en.Wedoany.com Reported - On June 2, Guotai Haitong Securities released a report on the completion of the IPO tutoring work for Shenzhen HOPERF Microelectronics Co., Ltd. (HOPERF, referred to as "HOPERF"), announcing that HOPERF has officially completed its IPO tutoring. Since signing the tutoring agreement in January 2023 until May 20, 2026, spanning over three years, the tutoring institution conducted a total of 13 systematic tutoring sessions. This domestic Sub-GHz RF chip and high-precision MEMS sensor company has entered a critical phase in its sprint for an A-share listing.
Founded in 2004, HOPERF is a long-term independent innovator in the IoT semiconductor sector, holding dual qualifications as a National High-Tech Enterprise and a National Specialized and New "Little Giant" Enterprise. It has also established the Guangdong Provincial Engineering Technology Research Center for High-Precision MEMS Sensor Design, Packaging, and Calibration. The company is one of the few domestic system-on-chip design enterprises that integrates three core product lines: wireless RF, analog signal chain, and sensors. Focusing on wireless data transmission, environmental sensing, and IoT solutions, and based on self-developed chips, HOPERF has built a full-matrix product portfolio ranging from RF chips and wireless modules to pressure/temperature and humidity sensors, isolation chips, and driver devices, covering two major industrial chain segments of IoT: "information sensing and wireless signal transmission."
In the domestic Sub-GHz wireless RF field, HOPERF is a pioneer, adhering to a forward-looking independent chip development path and breaking the long-standing monopoly of overseas brands. Its products are widely used in scenarios such as industrial control measurement, energy and environmental protection, smart agriculture, automotive electronics, wireless smart meter centralized reading, smart cities, medical monitoring, building security, and smart homes, serving thousands of domestic and international brands. It has become a backbone force for domestic substitution of key IoT components in China.
HOPERF's industrial path started from terminal application services and gradually extended upstream, integrating the entire industrial chain from solution customization and product mass production to independent chip development. The company provides one-stop implementation services including selection consultation, free samples, testing support, full-cycle technical support, and reliability quality assurance, shortening customers' new product development cycles and driving product iteration and technology upgrades through cross-industry case studies.
HOPERF's self-developed RF chips, sensors, isolation devices, and other products are exported to dozens of countries and regions worldwide, with steadily increasing penetration in niche markets such as outdoor sports equipment, navigation terminals, industrial environmental monitoring, medical health devices, security equipment, and consumer electronics. The company's product portfolio covers two major business segments: wireless RF, and analog devices and signal chains, including multiple mature product series such as pressure sensors, temperature and humidity sensors, isolation chips, and non-isolated drivers.
The successful completion of this IPO tutoring marks an important milestone in HOPERF's industrialization development. The tutoring institution conducted standardized training focusing on corporate governance, internal control management, compliance operations, financial standards, and capital market rules, improving the company's modern governance structure. After completing the tutoring, HOPERF is one step closer to formally submitting its IPO application materials.
If the capital market listing proceeds smoothly, HOPERF will intensify its efforts in core technology breakthroughs, optimize its product matrix of wireless RF, analog signal chains, and sensors, deepen its presence in high-growth tracks such as IoT, automotive electronics, and industrial sensing, accelerate the import substitution of domestic chips in more high-end scenarios, and leverage the capital market platform to deepen its global layout, empowering the upgrade of China's integrated circuit industry.
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