en.Wedoany.com Reported - Zaram Technology announced on June 29 that it has signed a production supply agreement for its XGS-PON application-specific integrated circuit, with a contract value of approximately KRW 1.3 billion, accounting for 12.4% of its 2025 revenue (approximately KRW 10.6 billion). The product had previously completed the design and development phase in October 2025.

The fabless semiconductor company revealed that the XGS-PON chip will be supplied to a European Tier-1 telecommunications equipment manufacturer through a U.S. electronic components distributor. The contract period runs from June 26, 2026, to March 8, 2027. After completing wafer fabrication, packaging, and testing, shipments are expected to begin by the end of this year.

XGS-PON is a communication semiconductor used in passive optical networks, enabling a single optical fiber to connect multiple base stations or end-user devices. The company stated that by supporting a one-to-many network architecture, this technology offers efficiency advantages and lower deployment costs compared to traditional point-to-point connections. Zaram Technology's chip supports 10 Gbps transmission speeds.

This production order builds on prior design collaboration. In October 2023, Zaram Technology signed a contract worth KRW 16.5 billion with the same customer to develop the XGS-PON application-specific integrated circuit (ASIC). That development project was completed in October 2025.

CEO Baek Jun-hyun stated that the company expects this project to generate follow-up repeat production orders.

Zaram Technology is a fabless semiconductor company that designs and supplies custom chips according to customer specifications. Upon receiving customer chip requirements, the company simultaneously develops hardware and software, outsources manufacturing to foundry partners, and sells the finished semiconductor products directly to customers.