en.Wedoany.com Reported - The semiconductor packaging and testing plant being built by India's Tata Group in Assam will receive a total of ₹140.44 billion in government incentives. Of this, the central government will provide ₹102.55 billion in support to Tata Electronics, while the Assam state government has separately approved ₹37.89 billion in subsidies. The total project investment is ₹270 billion, and it is expected to create over 27,000 jobs, of which approximately 15,000 will be direct employment.
Located in Jagiroad, Morigaon district, Assam, the project is positioned as an outsourced semiconductor assembly and test (OSAT) facility. Unlike wafer fabrication plants that directly process silicon wafers, the packaging and testing plant receives bare dies that have completed wafer manufacturing. Through processes such as dicing, die attach, interconnection, encapsulation, and performance testing, the bare dies are processed into finished chips that can be integrated into automobiles, communication equipment, industrial control systems, and consumer electronics.
The plant is planned to have a daily production capacity of 48 million chips, primarily utilizing technologies such as wire bonding, flip chip, and integrated system-in-package (SiP). Flip chip technology directly connects the active side of the die to the package substrate using solder bumps, shortening signal transmission paths and improving heat dissipation and high-speed data transfer capabilities. Integrated SiP technology can combine processors, memory chips, sensors, power management devices, and passive components into a single package, making it suitable for automotive electronics, communication infrastructure, artificial intelligence, and Internet of Things (IoT) devices.
After the packaging process is completed, the chips must undergo electrical performance, power consumption, temperature adaptability, and reliability testing. Testing equipment applies different voltages, frequencies, and workloads to each chip, screening out products with internal connection defects, substandard performance, or instability under high-temperature operation. The design scale of 48 million chips per day means the plant also needs to be equipped with a large number of automated packaging lines, testers, probe equipment, temperature control systems, and chip sorting equipment.
Tata Electronics has clearly stated that the Jagiroad plant will serve global customers and has partnered with Qualcomm to produce automotive computing modules. The product range for this project includes not only traditional consumer electronics chips but also modules for advanced driver-assistance systems (ADAS), cockpit control, in-vehicle communication, and power management. Qualcomm's automotive modules are planned for manufacturing at this facility, ensuring that the project already has specific automotive semiconductor application orders before full-scale production begins.
The plant is being built on the site of the former Hindustan Paper Corporation's Nagaon paper mill, covering approximately 592 acres. The space of the closed traditional paper industry is being transformed into a chip packaging and testing base, with the production process shifting from pulp and paper equipment to cleanrooms, wafer dicing, flip-chip bonding, system-in-package, chip testing, and automated sorting.
