Wedoany.com Report-Dec.30, According to reports, Samsung Electronics' wafer fab located in Taylor, Texas, USA, is accelerating its comprehensive layout of advanced processes, with the planned process technology being upgraded from the originally intended 4nm to 2nm.

The Taylor fab has recently placed orders for semiconductor manufacturing equipment compatible with 2nm. The first batch of equipment is scheduled to be introduced in March 2026, with initial manufacturing planned to commence as early as the second quarter of 2026, achieving mass production by 2027.

The report indicates that the fab's initial planned capacity level was 20k WPM, but this target has now been raised to 50k WPM, with plans to reach 100k WPM by 2027.