en.Wedoany.com Report, Oxfordshire, UK, March 2026 – UK technology systems integrator Direct Insight announced the launch and support for the new QSMP-20 soldered QFN-style System-on-Module (SoM). As a plug-and-play, pin-compatible upgrade to the QSMP-15, this module features an industrial-grade STM32MP2 microprocessor and opts for the more cost-effective and readily available DDR3 memory. This move aims to alleviate the lead time and cost pressures on DDR4 and DDR5 memory caused by surging demand from AI infrastructure. By adopting this differentiated memory selection strategy, Direct Insight's QSMP-20 SoM offers a viable alternative for industrial and embedded customers struggling with tight supply of high-end memory.
David Pashley, Co-founder and Managing Director of Direct Insight, stated: "The rapid development of AI technology is significantly impacting the semiconductor memory market. High-performance DDR5 and DDR4 are facing a surge in demand, leading to inventory shortages, price increases, and delivery delays. The QSMP-20 utilizes cost-effective and readily available DDR3L RAM, helping to avoid the current AI-driven supply challenges." Against the backdrop of large-scale AI infrastructure construction, the supply-demand imbalance for DDR4 and DDR5 memory has become a common issue for system integrators. Direct Insight's decision to revert to a DDR3 path for the QSMP-20 SoM reflects its pragmatic approach to supply chain risk management.
The QSMP-20 SoM is manufactured by Direct Insight's long-term partner, Ka-Ro Electronics of Aachen, Germany, and utilizes STMicroelectronics' STM32MP235 microprocessor. This processor is based on a heterogeneous architecture, integrating a 1.2 GHz dual-core ARM Cortex-A35, a 400MHz ARM Cortex-M33 coprocessor, a 0.6 TOPS NPU AI accelerator, and a 3D GPU. This processor configuration allows the QSMP-20 SoM to balance general-purpose computing and lightweight AI inference needs in power-sensitive applications. The inclusion of the NPU further expands its suitability for edge intelligence scenarios.
Regarding memory and storage configuration, the QSMP-20 SoM is equipped with 512MB of DDR3L RAM and 4GB of eMMC flash storage. It has a compact footprint of 27mm x 27mm and a height of only 2.6mm. The QFN-style pinout features a 1mm pitch and 100 edge pads, supporting miniaturization, improved thermal efficiency, and reduced electromagnetic interference. The module operates within a temperature range of -25°C to +85°C and requires only a 3.3V power supply, offering good deployment flexibility in both industrial environments and consumer devices. As a soldered-down SoM, the QSMP-20 offers inherent advantages in shock resistance, space utilization, and reliability compared to traditional connector-based modules.
In terms of interfaces, the QSMP-20 SoM provides extensive I/O options, including CAN-FD, UART, SPI, I²C, audio, Gigabit Ethernet, SD, USB, and MIPI-DSI display interfaces. This enables it to meet the connectivity requirements of various application scenarios such as smart home devices, industrial control terminals, and IoT gateways. Its compact, shielded package makes it particularly suitable for size- and power-sensitive applications. The module also features advanced security and power management capabilities, supporting low-power design and compliance with CRA cybersecurity regulations, providing a foundational platform for IoT and industrial applications that balances performance and compliance. The dedicated development kit accompanying the QSMP-20 SoM, which includes a Yocto Linux Board Support Package, can help development teams shorten time-to-market and accelerate the transition from evaluation to mass production.
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