MediaTek (Taiwan, China) Demonstrates 400Gbps MicroLED Interconnect

en.Wedoany.com Reported - MediaTek unveiled a new MicroLED-based optical interconnect technology at Computex 2026 in Taipei, aimed at addressing challenges in bandwidth, power consumption, and scalability for AI data centers. The company also deepened its collaboration with NVIDIA on AI PC and automotive platforms.

At the core of this launch is its Data Center Solutions (DCS) portfolio, encompassing custom ASICs, XPUs, advanced packaging, high-speed interconnects, and rack-level AI infrastructure. MediaTek demonstrated Co-Packaged Optics (CPO) technology, supporting transmission rates of up to 400Gbps per fiber, and showcased a MicroLED-based Active Optical Cable (AOC) architecture developed in collaboration with Microsoft Research's MOSAIC project. The company stated that this technology integrates MicroLED emitters directly into CMOS transceivers, reducing power consumption by 50% compared to traditional optical interconnect solutions while maintaining compatibility with existing infrastructure. This architecture can also be applied to future CPO and Near-Packaged Optics (NPO) designs for AI systems.

The approach employs a "wide and slow" architecture, replacing traditional fiber links that rely on high-speed channels and DSP-intensive PAM4 signaling with hundreds of parallel low-speed optical channels. MediaTek claims this design eliminates the need for complex DSPs while achieving higher bandwidth density, lower latency, and greater energy efficiency. The company currently demonstrates technology supporting 400Gbps fiber links and has outlined a roadmap toward 800Gbps, 1.6Tbps, and 3.2Tbps AI interconnects.

MediaTek also highlighted its collaboration results with NVIDIA. At the exhibition, the two companies demonstrated the NVIDIA DGX Spark platform based on the NVIDIA GB10 Grace Blackwell Superchip. This system combines a 20-core CPU with a Blackwell GPU, delivering up to 1 PetaFLOP of AI performance and featuring unified LPDDR5X memory for local AI model execution and agentic AI workloads. In the automotive sector, MediaTek showcased the Dimensity AX C-X1 smart cockpit platform, integrating NVIDIA AI and graphics technologies, supporting multimodal AI assistants, hybrid edge-cloud computing, and advanced human-machine interfaces. Additionally, the Dimensity AX MT2739 telematic platform was demonstrated, supporting 3GPP Release 18 5G NR-NTN satellite communication and satellite video calling capabilities.

Other demonstrations included Wi-Fi 8, 6G interoperability technologies, AI-enhanced networking platforms, fixed wireless access systems, AI-driven IoT applications, and edge computing solutions supporting cloud-to-edge agentic AI deployment. MediaTek President Joe Chen stated that the company holds a unique advantage in agentic AI from edge to cloud, with a strategy encompassing the provision of diverse computing platforms, advancement of data center technologies, and promotion of seamless communication.

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