en.Wedoany.com Reported - Teledyne Technologies Incorporated will exhibit its RF and microwave product portfolio, covering high-performance semiconductors, components, modules and interconnect devices, signal and power switching, and thermal imaging technology, at the International Microwave Symposium to be held in Boston from June 9 to 11.
At booth 19076, visitors can learn how Teledyne's integrated product portfolio provides solutions for the complete signal chain in communications, radar, and electronic warfare applications. Live demonstrations include the TSA-220060 3U VPX multi-channel converter, a dual wideband transceiver covering the 0.5–20 GHz frequency range with integrated local oscillator generation. Another demonstration features Non-Uniform Sampling (NUS) implemented via the EV10AS940 12.8 GSps ADC, enabling real-time signal detection and demodulation at reduced data throughput even under low signal-to-noise ratios. The booth will also showcase high-performance cables, connectors, and board-mount interconnect devices, demonstrated using the WavePulser® 40iX interconnect analyzer, providing real-time signal integrity insights up to 40 GHz.
A live thermal imaging demonstration will provide full-field temperature mapping for rapid identification of overheating components, electrical shorts, and thermal stress points. The booth will also feature a broader portfolio of RF and microwave technologies, including aerospace and defense components, precision switching and interconnect solutions, rapid prototyping, and advanced sensing technologies. Mark Kotilinek, President of Teledyne Defense Electronics, stated that Teledyne can address complex customer challenges across the entire RF chain, leveraging decades of expertise. The product portfolio evolves from component-level to complete systems, such as the Phobos and Deimos electronic warfare support measures solutions, continuously advancing to meet the performance requirements of mission-critical applications.
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