en.Wedoany.com Reported - SK Group Chairman Chey Tae-won revealed during the 2026 Computex Taipei that SK Hynix plans to triple its memory chip production capacity over the next eight years.

Chey stated that SK Hynix aims to achieve a total capacity three times its current level by 2034. The specific roadmap involves first doubling capacity within five years (around 2031), then adding the same incremental capacity over the following three years. This plan is based on significantly accelerating the construction of the "Yongin Semiconductor Cluster" project in South Korea. Originally scheduled to complete four factories by 2045, the cluster is now set to finish all construction by 2034. The first factory is under construction and is expected to begin delivering chips next year. Each new factory will be equipped with six clean rooms, operating as multi-story buildings, making individual factory capacity far higher than existing facilities, providing the physical foundation for the capacity leap.

SK Hynix disclosed a $410 billion investment estimate in November 2025. At that time, Chey noted that the Yongin wafer fab alone could potentially receive sustained investments of approximately 600 trillion Korean won, with the specific investment pace closely tied to market demand conditions. Regarding the selection of expansion regions, SK Group has recently shown an open attitude toward overseas factory construction. In an interview, Chey said Japan is considered to have significant opportunities, citing that local infrastructure, including electricity, water supply, engineering human resources, and chemical suppliers, is already well-established. A proposal from the United States was rejected in March this year.

This article is compiled by Wedoany. All AI citations must indicate the source as "Wedoany". If there is any infringement or other issues, please notify us promptly, and we will modify or delete it accordingly. Email: news@wedoany.com