en.Wedoany.com Reported - Synopsys has launched the first commercial products that integrate its electronic design automation (EDA) software with Ansys multiphysics technology, marking a key milestone less than a year after completing the acquisition of Ansys. The new Multiphysics Fusion product portfolio directly integrates physics-based analysis into the chip design flow, enabling engineers to consider power integrity, signal integrity, thermal effects, electromagnetic interactions, and packaging constraints in the early stages of design.
The initial release targets several critical aspects of advanced semiconductor development, including timing signoff, design closure, multi-die architectures, and analog and photonic design. Synopsys stated that the technology combines its AI-driven EDA platform with Ansys's "golden signoff" analysis tools, helping to reduce costly overdesign while improving design closure. The company noted that customer collaborations with Cisco, MediaTek, NVIDIA, and Samsung Foundry have validated this approach.
Reported advantages include up to 3x faster multiphysics timing analysis, up to 10x faster design closure, and concurrent thermal, power, and electromagnetic analysis for multi-die packages. This announcement reflects the growing industry demand for system-level co-design as AI accelerators increasingly rely on advanced packaging technologies such as 2.5D and 3D integration. Synopsys pointed out that multiphysics considerations now extend beyond traditional silicon design to encompass packaging, interconnects, photonics, and co-packaged optics. The new product portfolio also leverages NVIDIA CUDA-X libraries, including cuDSS, for GPU acceleration to speed up computationally intensive simulation workloads at advanced process nodes.
The Multiphysics Fusion product portfolio comprises four main components: Multiphysics Fusion for Timing Signoff combines PrimeTime, RedHawk-SC, RedHawk-SC Electrothermal, StarRC, and HFSS-IC to incorporate IR drop, thermal, and stress effects into timing analysis; Multiphysics Fusion for Design Closure combines PrimeClosure and RedHawk-SC to embed power integrity into signoff optimization, improving ECO success rates and power-performance-area (PPA) results; Multiphysics Fusion for Multi-Die Design combines Synopsys 3DIC Compiler with Ansys multiphysics technology to provide concurrent analysis of power, thermal, and electromagnetic interactions on advanced packages; Multiphysics Fusion for Analog and Photonic Design combines Custom Compiler with HFSS-IC and OptoCompiler with Lumerical to support photonic IC and co-packaged optics development.
Sanjay Bali, Senior Vice President of EDA Product Management and Strategy at Synopsys, stated that multiphysics is fundamentally reshaping the engineering approach to advanced semiconductor design, driving a shift from costly overdesign to integrated, system-aware co-design.
This release provides one of the clearest examples of Synopsys's integration strategy following the acquisition of Ansys. Traditionally, EDA vendors focused on logic and physical chip design, while AI processors increasingly require simultaneous co-optimization of silicon, packaging, power delivery, thermal management, photonics, and system-level integration. The combination of Synopsys design tools with Ansys simulation technology aims to transform multiphysics analysis from a late-stage verification activity into a continuous design methodology. The inclusion of photonic design and co-packaged optics workflows is particularly noteworthy, as Synopsys positions this combined platform not only for traditional semiconductor design but also for emerging AI infrastructure architectures that integrate optical interconnects directly into computing packages.
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