en.Wedoany.com Reported - Synopsys, Inc. announced the launch of its first deployable Multiphysics Fusion solutions. As chip design complexity continues to increase, issues such as signal integrity, power integrity, thermal integrity, electromagnetic effects, and co-packaged optics become more prominent in advanced nodes and multi-die architectures, driving urgent industry demand for integrating EDA with multiphysics design. This multiphysics fusion portfolio combines Synopsys EDA tools with Ansys' signoff analysis capabilities in timing signoff, design closure, multi-die design, and simulation workflows. Synopsys stated that these solutions aim to improve design predictability and support convergence for AI and high-performance computing systems.
The first multiphysics fusion solutions are based on the direction proposed by Synopsys Converge 2026 and include GPU-accelerated workflows leveraging NVIDIA CUDA-X libraries such as cuDSS. The multiphysics fusion for timing signoff delivers SPICE-accurate multiphysics timing analysis, which Synopsys claims can achieve up to three times faster runtime. This workflow integrates Synopsys PrimeTime, RedHawk-SC, and RedHawk-SC Electrothermal, combined with full-spectrum RC extraction using Synopsys StarRC and multiphysics HFSS-IC, to account for IR drop, thermal, and stress effects in timing analysis. The multiphysics fusion for design closure provides a design closure workflow that Synopsys says can achieve up to ten times faster runtime while supporting engineering change order (ECO) success rates and power, performance, and area (PPA) targets. This workflow combines Synopsys PrimeClosure with RedHawk-SC, incorporating power integrity into signoff optimization and reducing design iteration cycles. The multiphysics fusion for multi-die design integrates the Synopsys 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal, and multiphysics HFSS-IC to enable parallel processing of power integrity, thermal analysis, and electromagnetic analysis, providing system-level insights from design exploration to signoff. The multiphysics fusion for analog and photonic design integrates Synopsys Custom Compiler with multiphysics HFSS-IC for on-chip electromagnetic analysis in analog design workflows, and combines Synopsys OptoCompiler with Lumerical for photonic IC and co-packaged optics design.
Synopsys stated that it has initiated early collaborations with semiconductor and systems companies to evaluate the multiphysics fusion solutions. The Cisco Silicon One team is using Synopsys multiphysics fusion technology to incorporate IR drop effects into signoff design closure and gain earlier visibility into operating conditions. According to Synopsys, combining timing-aware IR correction helps optimize power integrity issues, as well as power, performance, and area (PPA) trade-offs and runtime, at an earlier stage.
The multiphysics fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are now available. For more information, visit synopsys.com.
This article is compiled by Wedoany. All AI citations must indicate the source as "Wedoany". If there is any infringement or other issues, please notify us promptly, and we will modify or delete it accordingly. Email: news@wedoany.com
