en.Wedoany.com Reported - Foxconn, Radiall, and Thales held a groundbreaking ceremony for their semiconductor outsourcing packaging and testing (OSAT) joint venture, Tessalia Technology SAS, in Le Barp, France. The venture aims to produce over 50 million system-in-package (SiP) components annually by 2033.
In early June 2026, at the groundbreaking ceremony held during the "Choose France 2026" summit, French Deputy Minister of Industry Sébastien Martin, Foxconn S Business Group President Dr. Bob Wei-Ming Chen, Radiall Chairman and CEO Pierre Gattaz, Thales Chairman and CEO Patrice Caine, and President of the Nouvelle-Aquitaine Region Alain Rousset jointly attended. The project officially landed in Le Barp (Nouvelle-Aquitaine Region), near Bordeaux, one year after French President Emmanuel Macron announced the three companies' initiation of preliminary negotiations at the "Choose France 2025" summit. Located near the "Rota do Laser," the site benefits from numerous cleanrooms and a high concentration of specialized talent, situated at the heart of a rich academic and industrial ecosystem.
The joint venture's name, Tessalia, is derived from the Latin word tessella (mosaic tile). The three companies will integrate their respective capabilities: Foxconn, the world's largest electronic manufacturing services provider; Radiall, a leading French manufacturer of high-performance interconnect solutions serving demanding industries such as aerospace; and Thales, a global advanced technology leader. The venture will focus on designing, testing, and assembling advanced system-in-package (SiP) solutions for the aerospace, telecommunications infrastructure, automotive, and medical sectors.
Tessalia will employ innovative packaging technologies, focusing on developing ultra-high-density packaging aimed at simplifying printed circuit boards (PCBs), creating smaller and lighter components, and enhancing integration capabilities. This technology is expected to drive progress in the performance and competitiveness of future products. The venture will obtain technology from Foxconn through an established licensing agreement, aiming to become a sovereign and competitive enterprise to meet Europe's needs in strategic areas of semiconductor packaging. Its operating model provides customers with a single interface to manage the entire implementation process of advanced electronic chip packaging, reducing cycle times and minimizing the carbon footprint by shortening transportation distances between multiple global suppliers, while promoting autonomous and transparent operations.
Production is expected to commence by the end of 2029, with a plan to produce over 50 million SiP components annually by 2033. This initiative aims to attract other industry players, supporting an investment that could exceed €250 million (by 2033), and will employ 800 staff at maximum capacity. The project represents a significant step in strengthening the French and European semiconductor ecosystem, in line with the European Union's Chips Act.
French Deputy Minister of Industry Sébastien Martin stated that from one "Choose France" summit to the next, this strategic project has successfully transformed vision into action, choosing Le Barp to establish a unique factory in Europe to complement the semiconductor value chain and strengthen European sovereignty. Radiall Chairman and CEO Pierre Gattaz noted that this new capability is a key sovereign asset for the French and European semiconductor industry, fully aligned with Radiall's strategy to develop next-generation advanced connectivity solutions for demanding applications. Foxconn Chairman Young Liu expressed that this is not just a factory, but a strategic platform for advanced manufacturing, semiconductor resilience, and future technologies in Europe, also supporting Foxconn's "Build-Operate-Localize" strategy. Thales Chairman and CEO Patrice Caine emphasized that Tessalia embodies the shared ambition of all parties to establish an innovative and competitive European player in the advanced semiconductor packaging market under a highly competitive environment, as part of Thales' strategy for independence and control over its electronics product value chain. President of the Nouvelle-Aquitaine Region Alain Rousset stated that this strategic factory is crucial for the sovereignty of the electronics industry, strengthening a regional ecosystem that already supports 20,000 jobs, and is a reward for the region's reindustrialization efforts.
Foxconn (TWSE:2317) is one of the world's largest electronics manufacturers, ranking 28th in the Fortune Global 500, with 2025 revenue reaching NT$8.1 trillion (approximately US$260 billion) and holding over 40% of the electronic manufacturing services (EMS) market share. The company operates over 240 facilities in 24 countries, employing approximately 900,000 people during peak production. Founded in 1952, Radiall employs over 3,500 people globally, offering a wide range of products including RF connectors and cables, coaxial switches, fiber optic and microwave components, and multi-contact connectors. Thales (Euronext Paris: HO) is a global advanced technology leader with over 85,000 employees in 65 countries, investing €4.5 billion annually in R&D in strategic areas such as artificial intelligence, cybersecurity, quantum technology, and cloud computing. Its products and services help address challenges related to sovereignty, security, sustainability, and inclusivity.
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