en.Wedoany.com Reported - On the evening of June 24, JCET (Jiangsu Changjiang Electronics Technology Co., Ltd.) announced an external investment on the Shanghai Stock Exchange. The announcement stated that the company plans to establish a controlled subsidiary to build a high-end advanced packaging and testing production base in the Wanxiang Industrial Park of the Oriental Chip Port in the Lingang New Area of Shanghai. The total investment for the project is 7.8 billion yuan, with the final investment amount subject to actual construction costs; the registered capital of the newly established project company is proposed to be 4 billion yuan, with the remaining funds to be raised by the project entity itself.

The project will be implemented in two phases. Phase I includes civil works for cleanroom buildings, interior decoration, and procurement of production equipment, with a clear construction timeline and a planned completion date in the second half of 2028. Phase II focuses on equipment additions and capacity expansion, with construction progress to be flexibly adjusted based on the implementation status of Phase I and downstream market order demand.

The investment proposal has been reviewed and approved by the company's board of directors, with all votes in favor. The announcement stated that this matter does not require submission to the shareholders' meeting for approval, nor does it constitute a related-party transaction or a major asset restructuring. The board of directors also authorized the management team to engage with local authorities, negotiate land and supporting policies, and advance preparatory work such as the establishment of the joint venture entity and preliminary business negotiations.

The company disclosed that this expansion is aimed at accelerating the deployment of high-end advanced packaging capacity, improving the domestic industrial layout, further consolidating business scale, and enhancing overall market competitiveness. JCET offers a full range of advanced packaging and testing technologies, including wafer-level packaging, 2.5D/3D packaging, system-in-package, and flip-chip packaging, with products targeting application areas such as AI computing chips, high-performance processors, memory chips, and automotive electronics.

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