en.Wedoany.com Reported - Lingchuan Technology recently completed a Series A+ financing round of hundreds of millions of yuan. This round was led by Qifu Capital, with co-investment from industrial investor New Guodu, as well as institutions including Jinpu Investment, Zhaohui Capital, BV Baidu Ventures, Shuimu Investment Group, and Yizhuang Kechuang Phase II Fund (Beijing Kechuang Yizhuang Direct Investment Fund). A globally renowned family office also participated, and existing investors Shunxi Fund and Jiuzhi Capital continued to increase their investment.

The project is based in Beijing Yizhuang and has received key support from Yizhuang State-owned Investment. The funds from this financing round will primarily be used for next-generation chip R&D, scaling up production of the existing product SL200, and expanding into overseas markets.

Founded in March 2024, Lingchuan Technology was jointly established by the Beijing Artificial Intelligence Fund and Kuaishou Group. The company was formerly Kuaishou Group's Heterogeneous Computing and Chip Division. It is a hardware-based software enterprise focused on the underlying computing power for multimodal large models such as intelligent video and generative video. The SL200 chip, independently developed by the team within Kuaishou, is an intelligent video SOC chip. Tens of thousands of these chips have been deployed at Kuaishou, stably serving 700 million users. The company was officially spun off and began independent operations in March 2024.

According to reports, Lingchuan Technology pioneered a 3D near-memory architecture. Its next-generation chip, utilizing a fully domestically produced 3D stacking technology, completed tape-out in April this year. This chip features targeted designs addressing key issues such as heat dissipation, consistency, and reliability in 3D chips, representing a concrete application of the Tau (τ) law for internet data center scenarios.

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