en.Wedoany.com Reported - Forehope Electronics (688362.SH) announced on the evening of June 26 that it plans to invest 10.3 billion yuan in the China-Italy Ningbo Ecological Park to build the "Microelectronics High-End Integrated Circuit IC Packaging and Testing Phase III Project." The project's product lines cover BUMP, 2.5D, FC-type, WB-type, etc., and the construction site is located in Yuyao City, Ningbo City, Zhejiang Province. The expected construction period is 96 months, and it will be built in phases with staggered production launches.

In the integrated circuit industry, as process technologies approach physical limits, advanced packaging technology has become an important way to enhance overall chip performance. Forehope Electronics stated that the downstream demand for high-end chips is clearly outstripping supply. As a domestic supplier of mid-to-high-end advanced packaging, the company must seize industry opportunities to plan and layout in multi-dimensional heterogeneous advanced packaging technologies. The announcement noted that the project will focus on cutting-edge advanced packaging processes in the industry, promoting the industrialization of technology. This will help improve the company's R&D and industrialization capabilities in the high-end chip packaging field and deepen its layout in wafer-level advanced packaging business.

Forehope Electronics' main business is integrated circuit packaging and testing, with a focus on mid-to-high-end packaging and advanced packaging technologies. The company has previously built the "FH-BSAP Building Block" advanced packaging technology platform, focusing on high-end routes such as Bumping, wafer-level packaging, FC-BGA, and 2.5D/3D. Its 2.5D packaging production line was already connected in the fourth quarter of 2024. Looking back at the capacity construction history, the company's Phase II project had a total investment of approximately 11 billion yuan, with the factory building completed in September 2023, followed mainly by the procurement of advanced packaging equipment and factory decoration. The launch of this Phase III project represents a further escalation of the company's efforts in the advanced packaging field. Since the beginning of this year, leading companies in the packaging and testing industry have been intensifying capacity expansion. On June 24, JCET announced a planned investment of 7.8 billion yuan to build a high-end advanced packaging and testing factory in Shanghai Lingang; in April, Tongfu Microelectronics disclosed plans to raise no more than 4.22 billion yuan through a private placement, to be invested in areas such as memory chips and automotive electronics; in May, Huatian Technology disclosed that its subsidiary plans to invest 3 billion yuan to build the second phase of the Nanjing Advanced Packaging and Testing Industry Base Phase II project.

The pressure of financing a ten-billion-yuan investment cannot be ignored. In 2025, Forehope Electronics achieved operating revenue of 4.398 billion yuan and net profit attributable to the parent company of 81.7286 million yuan. As of the end of 2025, the company's total assets were 15.191 billion yuan, with an asset-liability ratio of 73.05%, and a monetary fund balance of 2.115 billion yuan at the end of the first quarter. In the announcement, the company stated that the funding sources include its own funds, bank loans, or other self-raised funds, and there is a risk that the funds may not be raised as expected or may not be available in full and on time. If debt financing is adopted and the expected economic benefits are not achieved after completion, the company will face significant debt repayment pressure and financial risks. Additionally, the construction period of up to 8 years adds uncertainty to capacity digestion. If customer demand growth slows, customer introduction falls short of expectations, or industry overcapacity occurs, the company's new capacity may face the risk of not being digested in a timely manner. This investment still needs to be submitted to the company's shareholders' meeting for review.

This article is compiled by Wedoany. All AI citations must indicate the source as "Wedoany". If there is any infringement or other issues, please notify us promptly, and we will modify or delete it accordingly. Email: news@wedoany.com