en.Wedoany.com Reported - BAE Systems announced that its new radiation-hardened system-on-chip (SoC), the Endura System-on-Chip, designed specifically for space missions, has completed testing, verifying its tolerance to natural cosmic radiation and higher radiation levels that may be encountered during long-duration missions.

The core challenge for space electronics is that continuous radiation exposure can lead to chip failures, memory corruption, or even complete processor destruction. To address this, BAE Systems has adopted its proprietary RH45 technology for the new Endura SoC, manufactured using a 45nm process. Production is carried out at GlobalFoundries' facility in New York State, utilizing silicon-on-insulator (SOI) technology to enhance the chip's radiation tolerance. This SoC will be used in satellites, interplanetary space stations, and military spacecraft to ensure reliable operation in long-term radiation environments.

The processor integrates a central computing core, network interface, secure boot system, Level 1 and Level 2 built-in caches, and a programmable logic module FPGA. The FPGA can be reconfigured for specific mission requirements to accelerate data processing without replacing the chip. Developers indicate that RH45 technology is not only applicable to this SoC but can also be used to manufacture other space computing systems, such as single-board computers and satellite-specific electronic devices.

BAE Systems expects the Endura SoC to become the core of its next-generation space computing platform, suitable for Class A missions with the highest reliability requirements, as well as more cost-effective Class C and Class D devices. The company has begun accepting orders for software development kits for the new processor. Mass production will take place at BAE Systems' facility in Manassas, Virginia, which has been certified by the U.S. Department of Defense as a trusted microelectronics manufacturer.

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