en.Wedoany.com Reported - Shanghai has established a complete wafer foundry echelon covering advanced logic, mature analog, automotive-grade power, and third-generation semiconductors, positioning itself as a core hub for domestic chip manufacturing in China. This layout is primarily concentrated in the Pudong Zhangjiang Science City, the Oriental Chip Port in the Lingang New Area, the Xuhui Caohejing Development Zone, Jiading District, and Songjiang District, encompassing production lines ranging from the advanced 14nm process to mature specialty technologies.
In Pudong Zhangjiang Science City, SMIC's Shanghai Zhangjiang facility operates both 8-inch and 12-inch dual-line fabs, covering mature analog and power devices with process nodes from 0.35μm to 90nm. Its monthly production capacity reaches 135,000 wafers, utilizing technologies including CMOS, BCD, high-voltage power, and RF SOI, serving consumer, industrial, and automotive-grade foundry services. SMIC South, as SMIC's advanced process fab, operates a 12-inch production line and is the primary advanced production line for the 14nm FinFET process in China, with a stable yield rate exceeding 95%. It mainly focuses on foundry services for logic chips, AI computing power, and mobile phone SoCs. Huali Microelectronics (Hua Hong Group) operates a 12-inch fab focusing on mature logic, memory, and RF processes at 65nm, 55nm, and 40nm nodes, with a monthly capacity of 38,000 wafers, primarily producing MCUs, NOR Flash, and image sensors. Hua Hong Grace's Fab 1, 2, and 3 form an 8-inch three-fab cluster, with process nodes ranging from 0.11μm to 0.35μm, covering BCD, power, IGBT, and RF technologies. The combined monthly capacity is 178,000 wafers, making it the largest 8-inch specialty process base in China. Shanghai Xinjinxin Microelectronics operates 6-inch and 8-inch fabs, utilizing BiCMOS, BCD, and TVS analog chip processes, with a monthly capacity of 10,000 wafers, primarily foundry for power management and home appliance ICs. The Shanghai Integrated Circuit Research and Development Center (ICRD) operates a 12-inch open-process R&D fab, providing multi-project wafer (MPW) verification and material/equipment testing services for the industry, without engaging in large-scale commercial foundry. The Oriental Chip Port in the Lingang New Area, as a hub for power and automotive-grade fabs, hosts several major projects. SMIC East (SMIC Lingang Fab 9) plans a total investment of over RMB 50 billion to build a 12-inch production line, focusing on the mature 28nm specialty process, including BCD, RF, and automotive MCUs. The planned total monthly capacity is 100,000 wafers, with Phase 1 achieving a capacity of 20,000 wafers per month by the end of 2024, and Phase 2 expected to commence production in the second half of 2026. GTA Semiconductor's Lingang facility operates 6-inch, 8-inch, and 12-inch production lines, as well as a dedicated SiC production line. Its processes cover automotive-grade IGBT, MOS, PMIC, SiC MOS/JBS, and MEMS. The total equivalent 8-inch capacity reaches 300,000 wafers per month, making it a leading automotive-grade power fab in China, supporting the new energy vehicle industry. The major project under construction, Chip Harbor Integration, will build a brand-new 12-inch fab with a registered capital of USD 5.5 billion, targeting process nodes from 55nm to 28nm, involving analog, power, and industrial control chips. It is planned to start construction in the third quarter of 2026 and be delivered for production by the end of 2027. Nexchip's Lingang project is also under construction, planning to build a specialty fab for 12-inch display drivers and CIS image sensors to supplement display chip manufacturing capacity.
In the Xuhui Caohejing Development Zone, GTA Semiconductor's Caohejing 8-inch facility operates a mature power fab with high-voltage BCD process. In 2026, it will add two new 8-inch production lines, along with a SiC pilot line, primarily serving the home appliance, industrial power, and automotive power device markets. In Jiading District, the Shanghai Institute of Microsystem and Information Technology (SITRI) operates an 8-inch MEMS pilot production line, specializing in MEMS sensors, microfluidics, and optical chips, providing process development and small-to-medium batch foundry services for research institutions and startups. In Songjiang District, GalaxyCore's Fab-Lite production line focuses on front-end supporting manufacturing for specialty CIS image sensors, commencing production in March 2026 to serve its own CMOS image sensor chips.
Other specialty compound and niche fabs in Shanghai include GalaxyCore's dedicated process supporting wafer manufacturing for image sensors, and Xinwei Semiconductor's 4-inch and 6-inch GaAs RF fabs, primarily providing foundry services for 5G RF power amplifier chips. Overall, Zhangjiang Science City gathers the advanced 14nm process and general-purpose logic and analog foundry lines for 8-inch and 12-inch wafers, forming a leading chip manufacturing cluster in China. The Lingang Oriental Chip Port is positioned for the mature 28nm process, automotive-grade power, and SiC third-generation semiconductors, serving as the core area for Shanghai's new capacity additions. Caohejing, Jiading, and Songjiang form a differentiated layout through niche specialty processes such as MEMS, display drivers, and RF compounds. This industrial landscape completes a multi-dimensional wafer foundry echelon encompassing advanced logic, mature analog processing, automotive-grade power, and third-generation semiconductors, building a core stronghold for domestic substitution.
