en.Wedoany.com Reported - Mitsubishi Heavy Industries, Ltd. (MHI) announced on July 16, 2026, that it has shipped a 10MW-class centrifugal chiller test unit to the United States to support the cooling needs of next-generation high-density AI workloads. The equipment is expected to arrive at the Port of Brunswick, Georgia, in July. This move marks a significant commercialization milestone in MHI's integrated AI infrastructure strategy, aimed at addressing the infrastructure challenges of expanding from traditional data centers to industrial-grade environments driven by the accelerated deployment of AI factories.
MHI is leveraging its expertise in power systems, cooling technology, and industrial engineering to advance its integrated AI infrastructure portfolio, combining advanced cooling, modular systems, and power technologies. Among these, the Modular Chiller Package (MCP) is a core product. This pre-engineered cooling system, centered on MHI's centrifugal chiller, integrates pumps, heat exchangers, and control systems into a modular architecture. It supports cooling architectures compatible with NVIDIA DSX and scalable liquid-cooled AI deployments, enabling flexible expansion while simplifying on-site engineering.
The MCP architecture effectively utilizes free cooling modes to improve Power Usage Effectiveness (PUE), and its closed-loop configuration helps mitigate the growing issues of water scarcity and Water Usage Effectiveness (WUE) in large data centers. Currently, the MCP is undergoing safety and regulatory certifications such as UL in the US, and the shipment of the centrifugal chiller supports the certification process ahead of commercial deployment. This solution aims to reduce on-site integration workload, helping hyperscale, colocation, and AI infrastructure operators efficiently manage cooling in high-compute-density scenarios.
Large-scale delivery of AI factories requires close coordination among computing, power, and cooling systems. NVIDIA DSX, as NVIDIA's AI factory-level platform, integrates design, simulation, operations, and ecosystem technologies. MHI has joined the NVIDIA Partner Network as a power and cooling partner, working with NVIDIA and ecosystem companies to advance integrated power and cooling solutions for NVIDIA DSX.
MHI's experience in energy, engineering, and industrial infrastructure systems underpins these solutions. Its centrifugal chillers are based on proven technology with a track record of application in mission-critical fields. Meanwhile, advanced power plans covering 800VDC are built on decades of experience in large-scale power infrastructure and transportation systems, and are being developed in collaboration with ecosystem partners.
"The growth of AI is driving a step-change in infrastructure scale and complexity," said Shin Gomi, Senior General Manager of Data Center and Energy Management at Mitsubishi Heavy Industries. "By combining advanced cooling technology, modular design, and industrial engineering expertise with NVIDIA AI infrastructure, MHI is helping to realize scalable, reliable, and energy-efficient AI infrastructure."
"AI factories require computing, power, and cooling to be designed as a system. NVIDIA DSX provides the platform for this system-level approach. MHI's work in large-scale cooling and 800VDC power infrastructure helps ecosystem partners build more scalable and energy-efficient AI factories," said Vladimir Troy, Vice President of AI Infrastructure at NVIDIA.
Looking ahead, MHI plans to continue expanding its integrated AI infrastructure portfolio through technology investments to meet the evolving needs of AI factories and high-density computing environments.
