AMD Expects Global CPU Market to Exceed $200 Billion by 2030

en.Wedoany.com Reported - On October 12, Lisa Su, CEO of U.S. semiconductor company AMD, stated at the Open Compute Project Global Summit that as agentic AI workloads grow, the company expects the total addressable CPU market to exceed $200 billion by 2030, with a compound annual growth rate of approximately 50% over the next four to five years. AMD also disclosed that its Helios rack-scale AI system began shipping in September, with the first units installed at customers including OpenAI, Meta, Microsoft, Oracle, and Anthropic, and related production is planned to scale continuously from the fourth quarter of 2026 through the first half of 2027.

In her summit keynote, Lisa Su said AMD has raised its CPU total addressable market forecast three times in the past nine months. According to company projections, by 2030, the data center AI accelerator market will approach $1.5 trillion, and AI inference workloads are expected to account for approximately 60% of the overall AI market. AMD called 2026 the "year of inference" and identified agentic workloads as the primary driver of CPU demand growth.

The Helios system uses a rack-scale computing architecture, integrating 72 AMD Instinct MI455X GPUs, EPYC series processors, and Pensando networking components. According to AMD's published configuration, a single rack can deliver up to 2.9 Exaflops of FP4 compute performance, equipped with 31TB of HBM4 memory, GPU-to-GPU scale-up interconnect bandwidth of up to 260TB/s, and scale-out network bandwidth of 43TB/s. The platform adopts the Open Rack Wide open rack specification and supports UALink and Ultra Ethernet related interconnect technologies.

At the summit, AMD also introduced a new Helion rack reference design for agentic AI. The platform adopts open compute specifications and offers two configurations: pure CPU and hybrid CPU-GPU. A pure CPU rack can accommodate up to 32,768 Zen 6 processor cores, while the hybrid configuration supports combinations of EPYC processors and Instinct MI350P accelerators, with liquid cooling and air cooling options available.

According to AMD's published implementation schedule, the Helion rack specification will be contributed to the OCP community, and partners plan to offer related rack configurations starting in November 2026. The solution features a 21-inch open rack design, adapting to the processor configuration needs of different enterprises and large data centers. The partner ecosystem includes server and rack system suppliers such as Supermicro and Wiwynn.