Mitsubishi Materials Develops Sintered Copper Bonding Material, Achieving Low-Temperature and High-Reliability Bonding

Wedoany.com Report on Feb 2nd, Mitsubishi Materials Corporation recently announced that, utilizing its proprietary copper powder manufacturing technology, it has successfully developed a new sintered copper bonding material employing sub-micron copper particles. This material includes two types: copper paste and copper sheets, which can achieve sintered bonding at lower temperatures compared to conventional copper powders.

This new sintered copper bonding material possesses excellent performance characteristics and is particularly suitable for application scenarios such as automotive and railway high-output power modules. It helps improve the heat resistance, work efficiency, and energy-saving effects of modules, providing a new material choice for technological advancement in related fields.

Mitsubishi Materials stated that the development of this sintered copper bonding material is based on the company's long-accumulated copper powder manufacturing technology. By using sub-micron copper particles, the temperature requirements during the sintering process are significantly reduced while maintaining high bonding reliability.

Currently, the company has begun to gradually advance the sampling work for this sintered copper bonding material. In the future, this material is expected to be applied in more high-power electronic devices, bringing new opportunities for industry development.