en.Wedoany.com Reported - Domestic power semiconductor manufacturer Jiangsu Hongwei Technology Co., Ltd. released an investor relations activity record announcement on May 8, 2026. The company's self-developed NCBSiC module has passed the complete machine certification of mainstream overseas AI server manufacturers and achieved small-batch supply, officially entering the high-end computing power supply chain. The company has implemented price adjustments for some non-core products since April 1, with an average increase of about 10%, and currently, most customers have shown good acceptance.
Before entering the core supply chain for computing power supplies, Hongwei Technology had been laying the groundwork in the silicon carbide (SiC) field for several years. In 2024, the company successfully developed automotive-grade 1200V SiC MOSFET chips, its silver sintering process passed reliability verification, and its 1200V SiC SBD chips passed system-level verification by multiple end customers. In December of the same year, its subsidiary Changzhou Xindongneng rolled off its 1 millionth automotive-grade electric drive double-sided heat dissipation plastic package module, with commutation loop parasitic inductance reduced to 6 to 8nH and thermal resistance reduced by about 30% compared to traditional solutions. The company's three-level SiC hybrid modules were simultaneously being supplied in batches to the UPS field.
The entry of the NCBSiC module into the AI server power supply chain comes against the backdrop of continuously increasing power density in AI server cabinets, which places higher demands on power semiconductors. Single-cabinet power consumption has been pushed from several kilowatts in traditional servers to 30 to 50 kilowatts or even higher. The efficiency bottlenecks of traditional silicon-based power devices in high-voltage, high-frequency, and high-temperature scenarios are becoming increasingly prominent. With its higher breakdown field strength, lower switching losses, and better thermal conductivity, silicon carbide is accelerating the replacement of silicon-based IGBTs and MOSFETs in core topologies such as PFC and LLC in AI server power supplies. The company's previously launched GVE series three-phase six-unit topology module, based on M7i+ chip technology, reduces total losses by about 15% under high-load conditions compared to the previous generation, with a maximum operating junction temperature extended to 185°C, accumulating process data for the subsequent engineering of SiC modules.
The high-voltage SST product line and gallium nitride (GaN) devices are two other parallel paths Hongwei Technology is pursuing for the evolution of power supply architectures in AI data centers. The company's existing 1700V GWB modules can be adapted for solid-state transformers, and the technical team is continuously advancing the R&D and industrialization of SiC and GaN devices. High-voltage SST products and GaN products are currently under joint R&D and sampling with leading domestic and international industry players. Subsidiary Hongwei Aisai has successfully developed a 650V GaN HEMT chip. Targeting NVIDIA's 800V HVDC architecture, which is set for large-scale deployment in 2027, the company has planned to launch GaN device products adapted for this system.
The company is simultaneously advancing SiC technology achievement transformation cooperation at the Huairou Laboratory in Beijing, concentrating resources to overcome high-voltage, high-current SiC chip technology. For the full year of 2025, Hongwei Technology achieved operating revenue of 1.348 billion yuan, a year-on-year increase of 1.23%, and net profit attributable to shareholders of the listed company was 17.1149 million yuan, turning losses into profits year-on-year. Industrial control business revenue accounted for about 50%, while new energy power generation and Automotive Industry" target="_blank">New Energy Vehicles each accounted for about 25%. Power modules contributed 1.034 billion yuan in revenue, accounting for approximately 76.7% of the total, remaining the company's pillar product line.
Following this small-batch delivery of NCBSiC modules, market focus will shift to the ramp-up speed and yield stability of subsequent mass supply, as well as the actual pace at which high-voltage SST and GaN products transition from joint R&D to order fulfillment. Power management chips and power devices are relatively obscure yet critical links in AI computing infrastructure; a failure in these components can cause an entire cabinet to go down. Leading AI server manufacturers have set high reliability thresholds and long-cycle verification processes for supplier introduction. Hongwei Technology passing this certification means its products have entered the first gate of this closed supply chain, but the scale release of subsequent mass production orders will still need to withstand continuous tests of delivery consistency and long-term reliability.
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