en.Wedoany.com Reported - PRINANO, in collaboration with Litec Technology, has achieved mass production of 8-inch optical chip wafers using its pneumatic wafer-level nanoimprint lithography (NIL) equipment PL-AS and a dual-layer imprint resist material and process, without any use of DUV lithography. The manufacturing cost is only one-tenth that of traditional DUV lithography solutions.

The PL-AS system achieves a linewidth resolution of less than 10 nanometers, with uniformity error of imprint pressure across the entire wafer surface controlled within 0.5%. It supports a residual layer-free imprint process, and alignment accuracy can be customized to the sub-100 nanometer level. The equipment is compatible with both planar and curved substrates and can accommodate both hard and flexible template types.

Compared to traditional roller-based wafer-level NIL, the PL-AS employs a surface-force application method, ensuring uniform force distribution across every nanoscale unit on the wafer surface, keeping RLT deviation below 2 nanometers. Its throughput also surpasses that of Canon's step-and-repeat NIL equipment. As a pneumatic system, the PL-AS has a simpler overall structure than DUV lithography systems, eliminating the need for expensive optical modules while allowing the use of longer-lasting composite templates. These factors collectively contribute to its significant cost advantage.

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