en.Wedoany.com Reported - On June 17, 2026, WPG South China, a subsidiary of WPG Holdings, a semiconductor component distributor focused on the Asia-Pacific market, announced a joint online seminar with domestic automotive-grade chip company SemiDrive, titled "Full-Stack Chip Solution: Accelerating Mass Production of Embodied Intelligence – SemiDrive's Embodied Intelligence Solution." The seminar provided an in-depth analysis of SemiDrive's full-stack automotive-grade chip matrix covering the "brain-cerebellum-joint execution" architecture.
Embodied intelligence is currently entering a critical phase of commercial deployment, with rapidly growing demand for humanoid, service, and industrial dexterous robots. However, the industry still faces challenges, including gaps in top-level computing power, real-time motion control, and joint actuation for OEMs, as well as a lack of mature verification solutions for robot safety, reliability, and mass production.
SemiDrive has deep expertise in intelligent cockpits and intelligent vehicle control. Its domestic high-end cockpit SoCs and vehicle control MCUs hold a leading market share in China, with over 12 million automotive-grade chips successfully deployed in mass production. The company has entered its Strategy 2.0 phase, proposing a development roadmap "from driving intelligence to general intelligence," transferring its highly reliable, safe, and integrated automotive-grade chip technology to the robotics sector, forming a dual-business model of automotive electronics and embodied intelligence.
Wu Zhengxin, Marketing Manager at SemiDrive, introduced the company's full-stack embodied intelligent chip solution during the seminar. This solution adopts a three-tier architecture featuring the R1 brain, D9 cerebellum, and E3-R execution end, enabling a complete "perception-decision-motion" chain for robots, with all chips adhering to automotive-grade standards.
The R1 series, serving as the central brain for robot embodied intelligence, is a top-level intelligent core SoC that supports on-device large model deployment, capable of running VLM/LLM for tasks such as environmental understanding, task planning, multimodal interaction, and global trajectory generation. This chip features an ARMv9 high-performance CPU cluster and a dedicated NPU computing unit, equipped with 10G high-speed Ethernet and native support for EtherCAT and TSN real-time buses. It can fuse data from multiple vision, LiDAR, and environmental sensors, operates across a temperature range of -40°C to 105°C, and achieves ISO 26262 ASIL-B functional safety certification.
The D9 series, serving as the robot's intelligent control cerebellum, includes two models: D9-Max and D9-Plus. The D9-Max targets high-end humanoid robots, featuring a 12-core 2.0GHz A55 CPU, an 8 TOPS NPU, and dual-channel vision DSPs, with EtherCAT master jitter accuracy below ±5μs, enabling synchronized drive of dozens of joints. The D9-Plus is a lightweight solution with a 5-core CPU architecture, suitable for small and service robots, with streamlined configurations to meet basic motion control needs. Both chips adopt a hard-isolated system architecture, enabling dual-system redundant monitoring and emergency braking, with built-in three pairs of 800MHz Cortex-R5F cores to meet real-time motor control requirements.
The E3-R series automotive-grade MCUs serve as the underlying execution core, targeting products such as LiDAR, motion hubs, joint modules, and dexterous hands. The E3118-R is suitable for various robot joints, featuring a dual-core Cortex-R5F architecture at 400MHz, with high-speed memory units and national encryption modules, and an ultra-compact package suitable for joint cavities. The E3116-R is specifically designed for five-fingered dexterous hands, with a 300MHz single-core architecture and multiple high-precision sampling modules, enabling millisecond-level synchronized control of five-finger movements. Both chips meet ASIL-B automotive-grade standards.
SemiDrive provides development kits and complete resources compatible with mainstream development ecosystems, helping manufacturers shorten R&D cycles and avoid underlying development risks. WPG South China will leverage its global distribution and technical channel advantages, with both parties collaborating to deliver integrated solutions for the robotics market, accelerating the large-scale deployment of the embodied intelligence industry through automotive-grade mass production solutions. WPG South China represents a comprehensive portfolio of brands, covering 3C, industrial electronics, and automotive electronics, offering a full range of products from basic components to core modules and IoT solutions to meet diverse customer procurement needs. Its technical capabilities encompass component promotion, subsystem and system integration solutions, IoT and cloud applications, and app development, with dedicated laboratories and professional equipment to help customers shorten R&D cycles and achieve rapid mass production.
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