en.Wedoany.com Reported - Element Six (E6) and Orbray, leaders in advanced materials, have announced a new phase in their collaboration, driven by a shared vision to deliver wafer-scale single-crystal diamond (WSC™) for next-generation applications. This partnership solidifies Element Six's position as the preferred partner for advanced diamond wafer solutions.
The two companies have successfully established a repeatable process for 3-inch WSC™ diamond, achieving advancements in size, uniformity, and manufacturability compared to traditional single-crystal (SC) diamond materials. Development of larger 4-inch substrates is underway.
A 2-inch wafer optimized for epitaxial applications is nearing completion, while 2-inch diamond wafers for thermal bonding applications are being prepared for mass production at E6's chemical vapor deposition (CVD) facility in Gresham, Oregon.
Since establishing their partnership, E6 and Orbray have focused on advancing wafer size and manufacturing maturity, aiming to accelerate the widespread adoption of WSC™ diamond in 6G wireless components, power and radio frequency electronics, sensing, thermal management, and quantum technologies.
These developments collectively represent a transition from research and development to scalable implementation, with the collaboration's focus shifting to refining production processes to support capacity expansion for industrial-scale manufacturing.
Siobhán Duffy, CEO of Element Six, stated that the partnership with Orbray builds on shared strengths in innovation, quality, and technical expertise, and that the progress achieved demonstrates how these core capabilities translate into tangible delivery, moving toward wafer-scale single-crystal diamond with the quality and quantity required by industrial customers.
Riyako Namiki, President and CEO of Orbray, added that the milestones achieved so far represent important steps in the journey embarked upon with Element Six, aimed at expanding the commercial use of single-crystal diamond, enhancing material capabilities, and achieving the manufacturing volumes needed to support the most demanding applications.
