vivo Pad6 Pro Makes a Stunning Debut: Starting at 4499 Yuan, Powered by Snapdragon 8 Gen 5 Supreme Edition to Set a New Benchmark for Flagship Productivity
March 30th - vivo officially launched its new-generation flagship tablet product, the ...
TCL Technology Plans to Acquire 45% Stake in Guangzhou TCL China Star Semiconductor for 9.325 Billion Yuan, Strengthening Display Panel Industry Layout
March 30th - TCL Technology announced in an evening statement that it plans to acquire...
vivo Launches X300 Ultra Smartphone Starting at 6999 Yuan, Imaging System Receives Comprehensive Upgrade
March 30th - vivo officially launched the X300 Ultra smartphone today, with a starting p...
Shanghai Iluvatar CoreX Semiconductor Co., Ltd. Releases First Post-IPO Performance Report, Core GPU Business Grows 149.6%
March 30 - Iluvatar Corex (9903.HK) released its first post-Hong Kong listing performan...
Direct Insight Launches QSMP-20 Soldered System-on-Module, Adopts DDR3 Memory to Mitigate AI Supply Chain Pressure
Oxfordshire, UK, March 2026 – UK technology systems integrator Direct Insight announce...
India Approves 29 Electronics Manufacturing Proposals Involving $751 Million Investment; Dixon Tech, Lohum Cleantech Among Beneficiaries
The Indian government recently approved 29 electronics manufacturing proposals with a...
High Boom in Memory Chips Continues to Spread, Cycle Resilience May Exceed Expectations
Since the beginning of this year, bolstered by a robust recovery in industry fundamentals and signif...
Apple, SK Hynix, TSMC, and Other Global Semiconductor Companies Advance AI and Supply Chain Layout in 2026
In 2026, the global semiconductor industry is undergoing a structural transformation, driven collect...
Sony Interactive Entertainment Announces Global PS5 Price Increase: $100 Hike in US, Effective April 2
On March 27 local time, Sony Interactive Entertainment announced that, in light of ongoing pressure ...
Moore Thread MTT S5000 Completes "Full-Stack" Validation of FlagOS AI Training, Achieving Stable Training of Trillions of Tokens
On March 27th, the Beijing Academy of Artificial Intelligence (BAAI) released the validation results...
CIQ Collaborates with AMD to Optimize Enterprise AI and HPC Infrastructure, Boosting US Data Center Development
CIQ, the founding support and services partner for Rocky Linux, recently announced a cooperation agr...
Synopsys' Full-Stack Solution Assists Arm in Launching AGI CPU in the U.S., Optimizing AI Chip Design and Verification
Synopsys, Inc. recently announced a collaboration with Arm to provide a full-stack design solution f...
With the cancellation of export tax rebates imminent, photovoltaic module prices have risen significantly, with leading manufacturers generally increasing prices by 15% to 20%
The photovoltaic module market has witnessed a significant round of price increases. Leading manufac...
NXP Semiconductors Launches Omlox Starter Kit in the U.S., Advancing Industrial Positioning Standardization
NXP Semiconductors recently announced the launch of the Omlox Starter Kit in collaboration with Sync...
Samsung Electronics Launches Galaxy A57 5G and A37 5G in Australia, Enhancing Mid-Range Phone AI Features
Samsung Electronics has introduced two mid-range smartphones, the Galaxy A57 5G and Galaxy A37 5G, i...
A New Milestone for ST: China-Made STM32 Officially Delivered
On March 20th, European MCU giant STMicroelectronics announced that the STM32 general-purpose microc...
NDRC Director Zheng Shanjie Meets with Samsung Electronics Chairman Lee Jae-yong: Welcomes Samsung to Seize Opportunities from China's Expanding Opening-up and Further Deepen Cooperation in China
On March 24, Zheng Shanjie, Director of the National Development and Reform Commission, met with Lee...
Arm Unveils Its First Self-Developed Data Center CPU: Designed for Agentic AI, Single-Rack Performance Doubles That of x86
On March 24th, Arm announced the extension of its product portfolio from IP licensing to mass-produc...
Shenzhen Unveils Three-Year Action Plan for AI Server Industry Chain: Focus on Tackling Advanced Packaging for Memory Chips, Developing Enterprise-Grade SSDs and Memory Modules
The Shenzhen Municipal Industry and Information Technology Bureau recently issued the "Shenzhen City...
Hisense Group and Shanghai Electric Sign Strategic Cooperation Agreement: Focus on Home Appliances, Energy, Automotive Parts, and Other Fields to Jointly Expand High-End Manufacturing and Green Energy Markets
On March 24, Hisense Group and Shanghai Electric Group officially signed a strategic cooperation agr...
Huagong Tech: Clear Demand Growth for 400G and 800G Optical Modules This Year, Accelerating Upgrade to 800G
On March 22, Huagong Tech stated on the interactive platform in response to investor inquiries that ...
Musk Announces Terafab Project in Austin, USA, Plans to Build World's Largest AI Chip Factory
In Austin, Texas, Elon Musk announced the Terafab project on Saturday, aimed at building the world's...
Apple CEO Cook: New Macs Set Record for First-Time Buyers, $599 MacBook Neo Becomes Top Choice for Switchers
Apple launched three new Mac models last week: the MacBook Neo, the MacBook Air with the M5 chip, an...
Qnity Electronics Partners with NVIDIA to Jointly Drive AI and Advanced Packaging Materials R&D
On March 18 local time, Qnity Electronics announced a new technical partnership with NVIDIA. The col...
Musk: Tesla's Self-Developed AI Chip AI6 May Achieve the Performance of Dual-SoC AI5 per Single Chip, Hardware-Software Co-Optimization Becomes the Core Path
On March 18 local time, Tesla CEO Elon Musk posted on a social media platform, further disclosing th...
Boston Micro Fabrication (BMF) Launches Desktop Micron-Precision 3D Printer in the US
Boston Micro Fabrication (BMF) recently launched the microArch S150 series of compact 3D printers. T...
Future Electronics in Canada Releases Q1 2026 Market Report, Rising Lead Times Highlight Semiconductor Supply Chain Recovery
Future Electronics, headquartered in Montreal, Canada, recently released its Market Conditions Repor...
NVIDIA Launches Feynman Chip, Ushering in the Era of Optical Interconnects; CPO Industry Faces Value Reassessment
Inter-chip interconnection, a core component of the global AI computing infrastructure, is undergoin...
NVIDIA CEO Jensen Huang Explains Trillion-Dollar Revenue Forecast: Solely from Blackwell and Rubin Chips, Excluding Other Businesses
On March 17 local time, NVIDIA CEO Jensen Huang further elaborated on the trillion-dollar revenue fo...
Kioxia America, Inc. in San Jose, California, USA, Launches KIOXIA GP Series SSDs Optimized for AI GPU Workloads
San Jose, Calif., March 17, 2026 – Kioxia America, Inc. announced the development of the KIOXIA GP s...