en.Wedoany.com Reported - Samsung Electronics has begun providing customers with samples of its upcoming 12-layer HBM4E (Fourth-Generation Enhanced High Bandwidth Memory) product line. The stack height achieved on a 4nm logic chip is an industry first in this field, marking a technological advancement for the next-generation High Bandwidth Memory (HBM) series. Unlike competitors' solutions that stack DRAM products on a passive interposer, Samsung's forward-looking product uses a thin silicon layer to route signals between memory and the GPU.
Samsung stated that HBM4E is designed to meet the fundamental memory needs of AI computing and hyperscale infrastructure, offering a stable pin speed of 14 Gb/s with performance scalable to 16 Gb/s, a 20% improvement over the previous generation HBM4, while delivering memory bandwidth of up to 3.6 TB/s per stack. This product offers 48GB capacity. The South Korean company said that compared to the previous generation, the improved packaging structure enhances energy efficiency by 16% and improves thermal resistance characteristics by over 14%.
Samsung noted that since the HBM4 product line began production in February, the company has received customer feedback and plans to initiate mass production of HBM4E following initial sample shipments and optimization. Sang Joon Hwang, Executive Vice President and Head of Samsung's Memory Development, stated: "After the successful mass production of HBM4, Samsung has once again demonstrated its unique technological advantages through HBM4E. Leveraging our advanced manufacturing capabilities and preemptive infrastructure investments, we will continue to drive growth in the global AI memory market."
Samsung has been riding the wave of memory demand to record profits, capitalizing on the growing need for memory components from AI infrastructure builders. As one of the three major memory manufacturers, Samsung has raised component prices amid surging demand, while expecting its HBM sales to more than triple in 2026. The South Korean company secured orders to supply HBM4 for Nvidia's upcoming Vera Rubin platform, engaging in fierce competition with rival SK Hynix. HBM4E was disclosed at GTC 2026, where Nvidia's annual showcase coincided with the two parties signing an agreement to collaborate on semiconductor engineering innovations spanning R&D, design, and manufacturing.
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