Qorvo Launches Broadband High-Isolation Switch Series to Simplify 5G Radio Architecture
en.Wedoany.com Reported - Qorvo (NASDAQ: QRVO) recently launched a new RF switch series covering the 50MHz to 10GHz frequency band, designed to simplify multi-band RF architectures. This product series reduces component count and improves signal integrity, making it suitable for efficient RF system design in 5G infrastructure, industrial, drone, and test applications.

As 5G radios expand to wider bandwidths and more frequency bands, including emerging spectrum such as FR3, designers face the challenge of maintaining isolation and signal integrity without increasing size, loss, and complexity. Existing solutions often rely on cascaded switch architectures or multiple narrowband components, leading to increased insertion loss, degraded linearity and signal integrity, while consuming more board space and requiring greater design effort.
Debbie Gibson, General Manager of Qorvo's Infrastructure Business, stated that designers no longer need to use cascaded switch architectures to achieve high isolation; the company achieves this performance across an extremely wide bandwidth with a single device. This approach reduces insertion loss, maintains signal linearity, and simplifies design, thereby improving reception performance in applications such as digital pre-distortion (DPD) feedback.
The newly launched QPC6144 is an SP4T broadband switch with over 65dB of isolation in a single device. The QPC6122 (SP2T) and QPC6188 (SP4T) achieve broadband absorptive switching functionality across the 50MHz to 10GHz range, providing a single platform solution for RF routing. These devices maintain low insertion loss and excellent linearity over wide bandwidths while reducing component count and simplifying design, making them suitable for calibration paths, general signal routing, and multi-band operation. This product series forms a unified switch platform that meets both high isolation and general routing needs. By consolidating switching functions into fewer components, engineers can reduce BOM complexity, simplify layout, and accelerate development processes across various applications.
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