en.Wedoany.com Reported - The IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo) will be held from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center (Bao'an). The expo covers the entire semiconductor manufacturing chain, including chip design, wafer fabrication, packaging and testing, core equipment, key materials, and components. Currently, over 80% of the booths have been reserved.
This year's expo focuses on industry hotspots such as AI computing power, HBM, lithography technology, advanced process nodes, advanced packaging, breakthroughs in domestic equipment and materials, third-generation semiconductors, and optoelectronic integration, showcasing cutting-edge technologies and innovative achievements. The IC Innovation Expo will be held concurrently with CIOE (China International Optoelectronic Expo) and elexcon Shenzhen Electronics Exhibition, with a total exhibition area of 340,000 square meters, gathering over 5,000 exhibitors and expected to attract more than 240,000 professional visitors, linking the semiconductor manufacturing, integrated circuit, optoelectronics, and electronic embedded systems sectors.
Leveraging the synergy of the three concurrent exhibitions, the expo creates a global buyer matrix, precisely covering professional visitors from multiple countries and regions, including the United States, Germany, the United Kingdom, India, Indonesia, Malaysia, Japan, South Korea, and Singapore. Overseas corporate visitors include AGC, ASM International, ASMPT, DENSO, GlobalFoundries, Marvell, Tower Semiconductor, OSI Electronics, Nikon, Canon, Applied Materials, Tokyo Electron, KLA, Lam Research, Advantest, Disco, Dow Chemical, Honeywell, BASF, Samsung Semiconductor, UMC, United Technology, Intel, Source Photonics, NVIDIA, Texas Instruments, Infineon, and STMicroelectronics.
The expo facilitates one-stop resource integration across the upstream and downstream supply chain, connecting the entire "chip-device-module-solution-application" ecosystem. Exhibitors can connect with audiences from core semiconductor sectors such as IDM, Fabless, Fab, and OSAT, as well as professional groups from downstream application fields including artificial intelligence, consumer electronics, automotive, communications and computing, displays, optoelectronics, and new energy. The expo offers a "One Pass for Three Exhibitions" service, allowing visitors to access the IC Innovation Expo, CIOE, and elexcon with a single pass.
This expo deeply collaborates with domestic and international research institutes, universities, and laboratories. Participating institutions include the Guangdong Zhongke Semiconductor Micro-Nano Manufacturing Technology Research Institute, Fok Ying Tung Research Institute of the Hong Kong University of Science and Technology, School of Integrated Circuits of Sun Yat-sen University, Guangdong Greater Bay Area Institute of Integrated Circuit and System Application, Shenzhen Institute of Advanced Technology Chiplet Microelectronics School, School of Integrated Circuits of Tsinghua University, Hong Kong University of Science and Technology, School of Integrated Circuits of Beijing Institute of Technology, Wuxi Photonic Chip Research Institute of Shanghai Jiao Tong University, School of Integrated Circuits of Shenzhen Polytechnic University, School of Microelectronics of South China Normal University, School of Integrated Circuits of Shenzhen Technology University, and Shenzhen Institute of Advanced Electronic Materials International Innovation Institute.
The expo establishes a "Manufacturing-Packaging-Equipment-Materials-Components" semiconductor industry matrix. In the wafer manufacturing and packaging/testing sectors, exhibitors include Shanghai Huali, Dongfang Jingyuan, Nexchip, BYD Semiconductor, Tongfu Microelectronics, Times Microelectronics, Yuntian Semiconductor, Huajin Semiconductor, Biwin Storage, and Tianxin Interconnect. In the semiconductor equipment sector, companies such as NAURA Technology, AMEC, ACM Research, Piotech, Shenyang Heyan, Yudu Semiconductor, Hwatsing Technology, Weichong Semiconductor, Huayu Semiconductor, Longyoude, Jingce Electronics, CETC, and U-Precision Technology focus on lithography, etching, and metrology/inspection. In the semiconductor materials sector, exhibitors including NSIG, Jiangfeng Electronics, Anji Technology, CSIC Specialty Gas, Shanghai Xinyang, Shanghai IC Materials Research Institute, and Qingyi Micro display materials such as silicon wafers, targets, and specialty gases. In the semiconductor core components sector, companies such as SKY Technology Development, SIASUN Semiconductor, Wanrui Cold Technology, HIWIN, and Kinglai Group showcase core components and intelligent manufacturing solutions. The three concurrent exhibitions also bring together semiconductor manufacturing and packaging/testing exhibitors including GlobalFoundries, Tower Semiconductor, ASMPT, ASE, USI, Schmid, Runhua Quanxin Micro, Qisheng, Jingchuang Advanced, Heyan, Lieqi, Pulai Xin, Weidi, Nuoding, Chudian, Shiyu, Yilong, Dacheng, Zhongwang Semikron, Zhongke Jinggong, Zhongke Guangzhi, Leishen, Shangjin, Yitiannuo, Zhilifang, Ketaiguangxin, Puxes, ISMC, Suruga Seiki, Dingqi, Derui Jinggong, Sanying Jingkong, Ennakl, Bozhong Semiconductor, Chuangshijie, Microsee Intelligent, Oxford Instruments, and Yoshinaga Shoji.
The chip exhibition area showcases a full range of products including AI chips, communication chips, memory chips, CPUs, sensors, analog/digital chips, power management ICs, RF chips, and driver ICs. Exhibitors such as ZTE Microelectronics, Beijing Ingenic, Montage Technology, Huada Jiutian, GrandiT, and Zhaoxin Integrated display domestic chips' technological breakthroughs in high-performance, high-reliability, automotive-grade, and industrial-grade applications. The three concurrent exhibitions also attract exhibitors including ARM, Renesas, T-Head, MindMotion, Nations Technologies, Guangyu Xinchen, Demi, Dongxin, Netac, Kangying, Shanghai Belling, Yangjie, Codaca, Sunway, Xin'an Semiconductor, Core Source, Tai Mao Semiconductor, Advantech, Forlinx, Chuanglong Technology, Sigmastar, ams OSRAM, Coherent II-VI, Source Photonics, GigaDevice, Mitsubishi Electric, Sanan Optoelectronics, Raysees, Ruixi Technology, Kun Teng, HiSilicon, Hisense, Xinsi Jie, Qixin, Nboa Optoelectronics, Everlight, Guoke Guangxin, Shijia, Dingxin, CIG, Yunling, Guangsen, Vertilite, Youxun, Mingyi Technology, Gongyan Tuoxin, Orange Ky, Migu, LUXIC, Guangzi, and Belling.
The expo will host over 20 professional forums concurrently, focusing on topics such as semiconductor manufacturing, advanced packaging and testing, compound semiconductors, intelligent manufacturing, and chips and chip applications. The International Integrated Circuit Innovation Summit Forum will invite academicians, experts, and corporate leaders to discuss topics including "AI Empowerment," "Chip-Cloud Synergy," and "Resilience of the Semiconductor Industry Chain and Supply Chain." The 10th International Workshop on Advanced Lithography (IWAPS 2026) covers the entire chain from lithography machines and metrology to photoresist materials, with participation from companies such as KLA (USA), Siemens (Germany), Fujifilm (Japan), and Quanxin Zhizao and Dongfang Jingyuan. The Global IC Industry Analyst Conference will gather industry think tanks from 25 countries to forecast the semiconductor market cycle and capacity layout from 2026 to 2030. The Semiconductor Manufacturing and Advanced Packaging & Testing Thematic Conference will focus on topics such as breakthroughs in HPC packaging technology, heterogeneous integration, key materials for AI heterogeneous integration packaging, and domestic breakthroughs in core components. The Chip Design and Application Series Forums cover application fields including AI, consumer electronics, automotive, RISC-V, industrial, and smart terminals. The three concurrent exhibitions also include forums such as the Optoelectronic Integration Technology and Industry Development Forum, the Optical Semiconductor Inspection Technology Forum, the Ultra-Precision Micro/Nano Optical Manufacturing Technology Forum, the Nanoimprint Manufacturing Technology Forum, and the Laser Technology Empowering Semiconductor Manufacturing Forum.
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