en.Wedoany.com Reported - Teradyne (NASDAQ: TER) and Tokyo Electron (TEL) have jointly launched an integrated test cell solution to support Known Good Die (KGD) screening for AI and data center chips. This solution combines Teradyne's UltraFLEXplus platform with TEL's Prexa single-die prober (SDP), targeting fabless design companies, foundries, and outsourced semiconductor assembly and test (OSAT) providers, offering quality screening at multiple test points in advanced packaging processes within a high-volume manufacturing environment.

AI and data center chips are increasingly adopting chiplet architectures, integrating multiple dies into a single 2.5D or 3D package. In such high-value packaged products, a single defective die can render the entire package unusable, making KGD screening critical for ensuring final yield, improving product quality, and maximizing throughput.

The joint solution from Teradyne and TEL provides a proven test cell designed to reduce integration risks during high-volume production. Within the test cell, the UltraFLEXplus test equipment works in tandem with the Prexa SDP to stabilize the temperature of the chip under test while managing the high power consumption typical of advanced AI chips.

Based on an open ecosystem architecture, this solution allows customers to flexibly select various probe cards, manipulators, and interface technologies, and can integrate other probers or test equipment as needed.

Shannon Poulin, President of Teradyne's Semiconductor Test Division, stated: "The pace of innovation in AI chip technology is unprecedented, and customers urgently need reliable screening at every stage of advanced packaging. The combination of TEL's advanced Prexa SDP and Teradyne's UltraFLEXplus provides a solution tailored for high-volume manufacturing, with thermal control accuracy, power density, and digital performance meeting the test requirements of today's AI and data center chips, broadly covering single-chip test scenarios."

This commercially available solution, co-developed by Teradyne and TEL, marks progress in meeting the stringent manufacturing demands of AI and data center chips. The integration of the UltraFLEXplus platform with the Prexa SDP prober offers customers a robust, production-ready KGD screening solution, ensuring that advanced 2.5D and 3D packages achieve the reliability and performance required for next-generation AI and data center architectures.

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