en.Wedoany.com Reported - On June 26, the Ministry of Science and Technology of Vietnam officially launched the Vietnam National Multi-Project Wafer Coordination Center (VNMPW/CC) in Hanoi, aiming to connect domestic chip research, development, and design needs, and promote its integration into the global semiconductor manufacturing ecosystem. Representatives from multiple technology enterprises, international semiconductor groups, research institutions, and universities offering related programs attended the inauguration ceremony.
This center is Vietnam's first national-level chip pilot production support platform, designed to align with the country's semiconductor development strategy and gradually transition into a key link in the global supply chain. Vietnam stated that the establishment of this platform is a concrete measure to implement multiple Party and government resolutions, enhance technological self-reliance, and pave the way for building national-level chip pilot production infrastructure, positioning the country among the few in Southeast Asia with such capabilities.
Currently, Vietnam's industrial-scale chip manufacturing capacity remains in a blank stage, with relatively underdeveloped research and pilot production infrastructure. Universities, research institutes, and chip design companies often have to send products to overseas factories for pilot production, a process that is not only costly but also time-consuming, directly limiting the commercialization of products. Data shows that each chip tape-out costs between $30,000 and $200,000, with waiting times typically ranging from 12 to 24 months.
Meanwhile, Vietnam's domestic semiconductor ecosystem is growing rapidly. The country currently has about 60 chip design companies, approximately 7,000 design engineers, and 166 universities offering semiconductor and related programs. Preliminary statistics indicate that 12 entities have registered pilot production needs for about 30,000 chips.
The newly established support center plans to address these bottlenecks using the Multi-Project Wafer (MPW) model, which integrates multiple chip designs onto a single wafer for tape-out, thereby sharing costs. This model is expected to shorten development cycles, reduce pilot production costs, and provide a technical pathway for the successful market launch of "Made in Vietnam" chips.
On the day of the inauguration, the center signed memoranda of understanding with 19 domestic and international partners, including global semiconductor leaders such as Intel, Infineon, Amkor, Cadence, and Synopsys; international wafer foundries like TSMC and GlobalFoundries; as well as universities and technology enterprises such as Vietnam National University, Ho Chi Minh City, Vietnam National University, Hanoi, Hanoi University of Science and Technology, Viettel, FPT, and VSAP Lab. These partners cover key stages from chip design to manufacturing, packaging, and testing.
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