The University of Florida, in collaboration with NASA, MIT, and other institutions, has sent a photonic artificial intelligence chip to the International Space Station via JAXA's HTV-XI spacecraft. This space semiconductor experiment marks the first in-orbit validation of photonic computing technology.

The mission is part of NASA's Materials International Space Station Experiment program, aimed at evaluating the tolerance of novel materials and devices in the extreme environment of low Earth orbit. The University of Florida research team is focused on testing the stability and computational performance of photonic semiconductor technology in space conditions, providing data support for developing high-performance computing systems suited to deep space exploration needs.

Professor Volker Sorger from the Department of Electrical and Computer Engineering at the University of Florida stated: "This mission represents the first in-space validation of photonic computing. By testing our photonic AI hardware during the International Space Station mission and launch, we are laying the foundation for future high-performance, radiation-hardened computing systems that are crucial for deep space exploration and satellite autonomy."

The prototype chip designed by the research team will be directly exposed to space radiation and atomic oxygen environments, with monitoring of changes in its performance parameters. This photonic AI chip experiment will advance the exploration of the technology's applications in satellite communication architectures, spacecraft autonomous navigation, and precision sensing. Project collaborators, including Pioneer Automation and Fraunhofer HHI Institute, participated in the prototype system development.

By analyzing in-orbit operational data from the chip, researchers will gain insights into the degradation patterns of photonic devices in space environments. These experimental results will guide the design direction of next-generation space computing systems, providing technical basis for building more robust, durable, and energy-efficient aerospace electronic devices.