en.Wedoany.com Reported - On June 3, the European Commission proposed the "European Technology Sovereignty Package," which includes the European Chips Act 2.0, the Cloud and AI Development Act, an Open Source Strategy, and a roadmap for Energy Digitalization and AI Strategy. The European Chips Act 2.0 focuses on semiconductors as a core direction, emphasizing the enhancement of Europe's capabilities in chip R&D, manufacturing, advanced packaging, and supply chain resilience.

The European Chips Act 2.0 is an update to the original European Chips Act. The first version of the European Chips Act came into effect in September 2023, with goals including strengthening Europe's semiconductor R&D capabilities, enhancing design, manufacturing, and advanced packaging capacities, expanding production capacity by 2030, alleviating talent shortages, and building a deeper understanding of the global semiconductor supply chain. This 2.0 version further focuses on industrial implementation and investment efficiency, aiming to shorten the distance from laboratory R&D to industrial application. The semiconductor industry chain is long, with high capital expenditure and strong dependence on equipment and materials. If Europe remains only in the research and pilot phase, it will be difficult to establish stable capabilities in advanced chip manufacturing, key equipment, materials, packaging and testing, and industrial support. The 2.0 version proposes expanding the concept of "first-of-a-kind" projects, accelerating the industrial absorption of R&D results, simplifying licensing procedures, and stimulating demand in the semiconductor value chain, targeting a more complete local chip ecosystem.

This policy was introduced at the SEMI European Policy Forum held in Brussels, which gathered representatives from semiconductor companies, policymakers, and stakeholders from member state governments.

For the European semiconductor industry, the key to the policy upgrade is not just the new documents themselves, but whether a linkage can be formed between R&D, manufacturing, investment approval, and market demand. Chip manufacturing requires the joint support of wafer fabs, equipment, materials, EDA software, advanced packaging, testing, talent, and customer demand; any single-point subsidy is unlikely to change the industrial structure alone. As AI, cloud computing, automotive electronics, communication networks, data processing, aerospace, and smart terminals continue to drive chip demand, the external dependence of European companies and public institutions on core digital technologies has become more prominent. By placing chips, cloud and AI, open source, and energy digitalization within the same set of technology sovereignty packages, the EU indicates that semiconductors have been integrated into a larger digital infrastructure security framework. Subsequent impacts will focus on coordination among member state projects, the approval speed of key factories, the filling of gaps in advanced packaging and testing capabilities, the openness of R&D platforms, and whether European companies can secure sufficiently stable local orders.

SEMI Europe believes that the updated framework signals the EU's continued support for the semiconductor industry and emphasizes the important role of coordination among governments, industry, and global partners in enhancing supply chain resilience and competitiveness. If the European Chips Act 2.0 moves into the specific implementation phase, semiconductor companies, equipment and material suppliers, R&D institutions, and member state governments will engage in more intensive cooperation around project identification, funding arrangements, talent development, and cross-border supply chain coordination. Whether the European semiconductor industry can move from a policy framework to improved production capacity and technological capabilities will ultimately depend on the speed of investment implementation, the completeness of industrial support, and the ability to meet customer demand.

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