Category: Integrated Circuit Engineering

SK Hynix Makes a Splash at GTC 2026: Focusing on AI Memory, Jointly Showcasing Liquid-Cooled eSSD and DGX Spark with NVIDIA

On March 17, SK Hynix announced its participation in "NVIDIA GTC 2026" (GPU Technology Conference), ...

2026-03-17

Motorola Unveils Razr Fold Clamshell Phone in Barcelona, Spain, Taking on Samsung's Galaxy Z Fold 7

At the Mobile World Congress in Barcelona, Spain, Motorola showcased its new Moto Razr Fold clamshel...

2026-03-17

CITIC Securities: NVIDIA's GTC Conference Approaches, Chip Portfolio Expected to Expand, Rubin Ultra Details May Be the Focus

CITIC Securities recently released a research report stating that the highly anticipated NVIDIA GTC ...

2026-03-16

Samsung Collaborates with NVIDIA on Next-Gen NAND Flash: AI Simulation Model Speeds Up by Ten Thousand Times, Storage Chip R&D Enters "Acceleration Mode"

On March 13th, according to industry sources, Samsung Electronics is collaborating with NVIDIA to ac...

2026-03-14

AMD Launches New PC Category: AI Agent Computers

American chipmaker AMD has recently introduced a new product category called "Agent Computers," aime...

2026-03-14

US Silicon Valley - South Korea's SK hynix and Applied Materials to Collaborate at EPIC Center on DRAM and HBM Development

American semiconductor equipment supplier Applied Materials and South Korean memory chip manufacture...

2026-03-13

Marvell Unveils 3nm 1.6T Optical DSPs, Targeting AI Data Center Demands

American chipmaker Marvell recently updated its 1.6T optical digital signal processor (DSP) product ...

2026-03-13

CITIC Securities: Computing Power Upgrade Drives Bandwidth Necessity, 800G Optical Module Growth Continues, 1.6T Enters Mass Production Cycle

A recent research report from CITIC Securities points out that with the continuous breakthroughs in ...

2026-03-11

ASUS Co-CEO S.Y. Hsu: Apple's MacBook Neo Low-Price Strategy Impacts Windows PC Market

During Tuesday's earnings call, ASUS Co-CEO S.Y. Hsu pointed out that Apple's launch of the MacBook ...

2026-03-11

Siemens Drives Global Semiconductor 3D IC Integration Technology Development to Address Moore's Law Limitations

The semiconductor industry is at a critical turning point, as the traditional model of Moore's Law f...

2026-03-11