China TOPSSD Launches Full-Chain Domestic Industrial SSD, Boosting Domestic Substitution by 2027
TOPSSD has launched a fully domestic industrial-grade solid-state storage solution, covering sectors...
South Korea's SK Hynix to List in the US as Early as August, Potentially Raising $14 Billion
SK Hynix plans to list in the United States as early as August. The South Korean memory chip manufac...
ChipMOS Technologies (China Taiwan) Reports May 2026 Revenue Up 17.7% Year-over-Year
ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150, NASDAQ: IMOS), a semiconductor packaging and...
Japan's LSTC Develops New 2nm Gate Insulator Film Technology
On June 9, Japan's Leading-edge Semiconductor Technology Center (LSTC) announced the development of ...
Japan's NTT Announces Establishment of Approximately 80 Billion Yen AI Investment Fund
On June 10, NTT announced the establishment of a fund to invest in AI startups, named "IOWN AI Fund,...
Mitsubishi Electric Launches Fifth-Generation SiC MOSFET with 25% Lower On-Resistance
Mitsubishi Electric Corporation has introduced fifth-generation silicon carbide (SiC) MOSFET bare di...
Belgium's imec Unveils World's First 802.15.4ab UWB Receiver, Quadrupling Ranging Performance
Imec, the Belgian microelectronics research center, has unveiled what it claims is the world's first...
AMD expects DDR5 memory prices to normalize by 2028
DDR5 memory prices are not expected to return to normal until 2028, according to the latest assessme...
China's HKC Establishes Semiconductor R&D Company to Extend Optoelectronics Layout
On June 10, Chengdu Huixin Semiconductor R&D Co., Ltd. was established, with legal representative Lu...
Northrop Grumman Launches W-Band GaN Chip
On June 10, Northrop Grumman Corporation developed a new W-band chip based on gallium nitride (GaN),...
Taiwan's TSMC Adopts NVIDIA AI, Boosting Lithography Efficiency by 20%-50%
NVIDIA stated that TSMC is leveraging its accelerated computing and AI technology to advance semicon...
South Korea's Imagis Technology Wins 5.8 Billion Won Automotive Chip Contract
According to a regulatory filing disclosed on June 8, South Korean chip design company Imagis Techno...
NVIDIA Halves SOCAMM2 Capacity Due to LPDDR Shortage
NVIDIA has reduced the capacity of its next-generation AI server memory module SOCAMM2 from the orig...
South Korea's SK Hynix Plans to Triple Wafer Production Capacity
On June 11, Chey Tae-won, Chairman of South Korea's SK Group, stated that its memory chip subsidiary...
South Korea's SK Hynix Enters Mass Production Preparation Phase for 375-Layer 3D NAND
June 11 news, South Korean memory chip company SK Hynix has completed mass production verification o...
UK Reseller: Apple Silicon Mac Failure Rate Halved, Total Cost of Ownership Reduced
Data disclosed by Hoxton Macs, an Apple reseller in London, UK, shows that the failure rate of Apple...
AWS Launches Graviton5 Instances in the US, Delivering 25% Performance Improvement
AWS announced that the Amazon EC2 M9g and M9gd instances, powered by the Graviton5 processor, are no...
AMD Announces 256-Core Venice Rack Performance Up to 3.3 Times That of NVIDIA Vera
Chip manufacturer AMD has released the first official benchmark results for its upcoming EPYC "Venic...
Brazil's Zilia Secures BRL 143.3 Million in BNDES Financing to Expand Semiconductor Production
The Brazilian National Bank for Economic and Social Development (Banco Nacional de Desenvolvimento E...
Irish Government Invests €460 Million to Establish Seven New Rinn Research Centres
The Irish government has announced an investment of €460 million to establish seven new Research Ire...
Apple's iPhone 18 Pro Expected to Replace Qualcomm with In-House C2 Modem
Apple is expected to use its self-developed C2 modem chip in the iPhone 18 Pro, thereby replacing th...
SanDisk to Launch 4TB and 8TB SDUC Memory Cards
SanDisk is advancing the commercialization of next-generation SDUC standard memory cards, planning t...
European Commission Unveils European Chips Act 2.0 to Accelerate Semiconductor Innovation
The European Commission has officially released the European Chips Act 2.0, aiming to enhance the co...
Intel Z970/Z990 Chipset Peak Power at 14W, Die Size Reduced by 22%
Intel's next-generation Nova Lake series processors will adopt a new socket and simultaneously intro...
China's Moore Threads Open-Sources GPU Operator Generation Code Large Model MusaCoder
On June 10, Chinese domestic GPU company Moore Threads announced the release and open-sourcing of Mu...
Bosch Launches Third-Generation SiC Chips in India, Boosting EV Efficiency by 20%
Bosch has launched third-generation silicon carbide semiconductors chips, providing higher performan...
Sony Japan Releases X-ray CMOS Sensor with 26,100 fps Frame Rate
Sony Semiconductor Solutions Corporation announced the upcoming release, mass production, and shipme...
India's Polymatech Invests $25 Million in Advanced Manufacturing Center in Singapore
AEIM Pte Ltd, a wholly owned subsidiary of Polymatech Electronics Limited, announced the official la...
MACOM Unveils Chip-Level Thermal Via Technology at IMS 2026
MACOM Technology Solutions has announced a new chip-level thermal via process based on its proprieta...
Nexperia and Semikron Danfoss Collaborate on Automotive-Grade SiC Power Modules
Nexperia B.V. and Semikron Danfoss GmbH have signed a Memorandum of Understanding to explore strateg...