en.Wedoany.com Reported - SABIC recently launched a new series of LNP™ THERMOCOMP™ modified compounds, specifically designed for high-power, high-voltage electric drive and power module applications, including insulated-gate bipolar transistor (IGBT) power switching devices. The series includes two grades, LNP THERMOCOMP OFM76XXP and OFM76EXP, both based on polyphenylene sulfide (PPS) resin. These materials offer good impact strength and dimensional stability, while achieving a high Comparative Tracking Index (CTI-PLC 0) rating and thermal shock resistance to meet more demanding application requirements. They also feature excellent heat resistance, effective insulation dielectric strength, and a UL94 V0 flame retardancy (FR) rating.
These high-performance materials can be used in power modules for electric vehicle traction inverters and fast chargers operating at 800 volts and above, as well as in industrial automation scenarios such as renewable energy systems and robotics. Sergi Monros, Vice President of SABIC's Specialties Business, stated that trends toward higher voltage, greater power density, and miniaturization are driving manufacturers of key power electronics devices, such as IGBT switches, to seek materials that enhance stability and power. By developing specialty thermoplastics that outperform existing solutions, SABIC is responding to evolving customer needs and continuously enhancing the functionality, performance, and reliability of its LNP modified compound portfolio.
The new LNP THERMOCOMP modified compounds offer the highest CTI rating, consistent with other PPS resins of the same grade, maintaining excellent strength and insulation properties under long-term high-temperature aging conditions, while also providing higher toughness. After 1000 hours of high-temperature aging at 200 degrees Celsius, their strength and insulation properties remain at 90%. Compared to polybutylene terephthalate (PBT) and polyphthalamide (PPA) materials, these compounds offer better dimensional stability and thermal shock resistance. The new grades support compact, lightweight designs with thin-wall flame retardancy (UL94 V0/0.4 mm) and can be produced in white or light colors to facilitate the identification of mandatory printed QR codes on IGBT devices.
The next-generation LNP THERMOCOMP OFM76EXP material features enhanced laser marking capability, the highest impact strength among similar materials, and outstanding adhesion to silicone-based sealants and crack resistance. In addition to IGBT module insulating substrates, these materials can be used in DC transmission systems, high-voltage inverters and circuit breakers, integrated busbar supports, and renewable energy infrastructure. The LNP THERMOCOMP OFM76XXP and OFM76EXP modified compounds are available globally.
