en.Wedoany.com Reported - China's HKC Corporation (001399.SZ) issued an announcement on July 17, 2026, stating that the company has signed the "Advanced Packaging and Testing Project Cooperation Agreement" with the Management Committee of the Hangzhou-Shaoxing Airport Economic Integration Development Demonstration Zone Shaoxing Area. It plans to invest 4 billion yuan to establish a wholly-owned subsidiary, Zhejiang Huixin Advanced Semiconductor Co., Ltd., as the project implementation entity to carry out advanced packaging and testing projects. This project is the first major external investment disclosed by HKC Corporation since its listing on the main board of the Shenzhen Stock Exchange on June 26, 2026.

HKC Corporation focuses on the semiconductor display field, with its main business covering the research and development, manufacturing, and sales of core display devices such as semiconductor display panels and intelligent display terminals. Its products span consumer electronics, commercial displays, and other areas. By investing in the advanced packaging and testing sector, the company aims to extend into high-value-added segments of the semiconductor industry chain.

The announcement indicates that the project will be built in two phases. Phase I plans to construct a 12-inch hybrid chip advanced packaging and testing production line, with a full-capacity output of 20 million units per month, and a construction period expected to not exceed three years. Phase II will be initiated as appropriate based on the implementation of Phase I, with specific investment plans, scale, and start time to be separately negotiated by both parties. The company stated that this project is currently in the preliminary preparation stage, with no mass production or revenue generated yet, and it is not expected to have a significant impact on the company's operating performance in the next 2 to 3 years.

Against the backdrop of the global semiconductor industry supply chain restructuring and the sustained growth of domestic chip packaging and testing market demand, HKC Corporation's entry into the advanced packaging and testing field represents an important initiative to proactively extend into high-value-added segments of the industry chain. The project's implementation entity, Zhejiang Huixin Advanced Semiconductor Co., Ltd., has a registered capital of 4 billion yuan. The advanced packaging and testing business has certain synergies with the company's existing panel business in terms of technical routes, and this investment will help the company cultivate new business growth drivers. This investment is a key layout for HKC Corporation to extend upstream in the semiconductor industry chain after its listing, and it is of great significance for enhancing the company's comprehensive competitiveness in the semiconductor display industry chain.