Chinese company Xinqi Microelectronics lists on Hong Kong Stock Exchange
Xinqi Microelectronics listed on the Hong Kong Stock Exchange on June 26, with an issue price of HKD...
Guangzhou Donghan Semiconductor's Billion-Level Project Breaks Ground
Donghan Semiconductor's Guangzhou base officially commenced construction on June 25, with a total in...
Microchip Launches Radiation-Tolerant Six-Output Clock Generator
Microchip Technology (Nasdaq: MCHP) has introduced the space-grade DSA504RT, a radiation-tolerant, p...
Keysight Technologies Acquires VPIphotonics to Expand Photonic Design Automation
On June 9, 2026, Keysight Technologies completed the acquisition of VPIphotonics, injecting system-l...
Samsung Electronics Coordinates Local Semiconductor Investment Plans with Korean Government
Samsung Electronics Chairman Lee Jae-yong had dinner with President Lee Jae-myung at the Blue House ...
Applied Materials Inc. Launches Advanced 3D Stacking Chip Manufacturing Systems
Chip manufacturing equipment company Applied Materials Inc. has introduced a new series of chip manu...
Micron Signs 16 Five-Year Agreements to Lock in Memory Profit Margins
Micron has secured high pricing for its products over the next five years by signing 16 "Strategic C...
Qualcomm Launches HBC Architecture, Delivering 6x Bandwidth per Watt vs HBM
Qualcomm has officially unveiled its latest near-memory computing architecture, High Bandwidth Compu...
US Invests $250 Million in I-Pulse to Develop Semiconductor Components
I-Pulse, co-founded by Robert Friedland, has secured $250 million in funding from the U.S. Departmen...
Microchip Launches Radiation-Tolerant Six-Output Clock Generator
Microchip Technology (Nasdaq: MCHP) has introduced the space-grade DSA504RT, a radiation-tolerant, p...
IBM Unveils World's First 0.7nm Chip Technology
IBM (USA) announced on June 25 (local time) what it claims to be the world's first sub-1nm chip tech...
German SUSE and Openchip Build European Sovereign RISC-V Technology Stack
SUSE and Openchip have announced a partnership to jointly build a European sovereign computing techn...
China's Siling Integrated invests 20 billion yuan to advance automotive-grade chip project
China's Siling Integrated Circuit Manufacturing Co., Ltd. announced on the evening of June 23 an inv...
China's JCET Invests 7.8 Billion Yuan to Build Advanced Packaging and Testing Plant in Shanghai Lingang
On the evening of June 24, JCET (Jiangsu Changjiang Electronics Technology Co., Ltd.) announced an e...
Apple's Mac high-end chip strategy shifts, pivoting to AI-focused M7
On June 25, Apple is making a significant adjustment to its Mac chip roadmap. The next-generation hi...
China's C-Zhenbao Semiconductor Components Achieve Mass Supply to SK Hynix
On June 25, Chinese semiconductor equipment component manufacturer C-Zhenbao stated in an investor i...
Mayor of Yongin, South Korea: Samsung Electronics to Build Six Semiconductor Fabs as Planned
Yongin Mayor Lee Sang-il stated on the 24th that, regarding Samsung Electronics and SK Hynix conside...
China's GigaDevice Collaborates with Qt Group to Optimize GD32H7 Embedded GUI
GigaDevice has established a strategic partnership with Qt Group, a provider of software design, dev...
GF Announces SLATE Technology Production Readiness on 9SW Platform in Singapore
GlobalFoundries (GF) has announced that its SLATE wafer-to-wafer bonding technology has achieved pro...
India seeks semiconductor investments at Pax Silica Summit
India will seek semiconductor investments and multilateral funding support at the second summit of P...
Qualcomm in Talks with ByteDance on Custom AI Chip Collaboration
Qualcomm is in discussions with ByteDance regarding custom chip design services. The U.S. chipmaker ...
South Korea's SPHERE AX and US-based Blaize Sign AI Semiconductor MOU
SPHERE AX and Blaize Holdings have signed a strategic memorandum of understanding to jointly develop...
Russian Top Systems and Digital Manufacturing Partner to Create Unified PCB Design System
Top Systems (Топ Системы), the developer of the Russian T-Flex PLM, and Digital Manufacturing (АО «Ц...
Korea's TLB and Company A Sign MOU to Develop Glass Substrate Technology
TLB, a Korean PCB specialized company, announced on the 24th that it has signed a Memorandum of Unde...
Samsung Unveils 1000-Layer NAND Plan, Quadrupling Capacity by 2030
Samsung unveiled its next-generation SSD technology roadmap at the 2026 VLSI Symposium, planning to ...
EU approves €76 million German aid for quantum diamond semiconductor facility
The European Commission has approved a €76 million German state aid measure to support QuantumDiamon...
SK Hynix Announces 61.9 Trillion Won AI Memory Investment Plan
SK Hynix will concentrate the funds raised from its American Depositary Receipt (ADR) listing on exp...
SK Key Foundry Mass Produces Bi-SCR-Based On-Chip EMC Protection Technology
SK Key Foundry has announced the launch of its "Bi-SCR-based on-chip EMC protection technology" desi...
Infineon Wins Two GaN Patent Infringement Rulings in Germany
Infineon Technologies has secured two patent infringement rulings against Innoscience at the Munich ...
STMicroelectronics' Post-Quantum Secure Chip ST54M to Enter Mass Production in July
STMicroelectronics has launched a secure mobile chip called the ST54M, designed to help smartphone a...