China's Suanmiao Technology 3D TokenPU Chip A4E Officially Tapes Out
Suanmiao Technology announced that its 3D TokenPU chip A4E, designed for large model inference, has ...
Micron Selects Bechtel as EPC Partner for Largest Semiconductor Fab in the U.S.
Micron Technology has selected Bechtel as its engineering, procurement, and construction (EPC) partn...
WPG South China and SemiDrive Launch Full-Stack Chip Solution for Embodied Intelligence
On June 17, 2026, WPG South China, a subsidiary of WPG Holdings, a semiconductor component distribut...
Sony Japan Launches LYTIA L910 Image Sensor with 100dB Dynamic Range, Shipping This Summer
Sony Semiconductor Solutions has launched the LYTIA L910 mobile image sensor, which achieves a 100dB...
Qualcomm Launches Snapdragon Reality Elite Chip with 160% NPU Performance Boost
Qualcomm has officially launched the Snapdragon Reality Elite chip, a new product designed for exten...
NVIDIA Signs Memory Supply and Gigawatt-Level AI Cloud Cooperation Agreements in South Korea
NVIDIA is solidifying its position in the AI infrastructure market through a series of agreements in...
US photonic hardware company PsiQuantum invests $940 million to build quantum computing facility in Australia
PsiQuantum, a US photonic hardware company, has officially commenced construction of a utility-scale...
Keysight Technologies Acquires VPIphotonics, Adds System-Level Simulation Capabilities
Keysight Technologies, Inc. (NYSE: KEYS) announced that it has completed the acquisition of VPIphoto...
Synopsys Releases First EDA Products Integrating Ansys Technology
Synopsys has launched the first commercial products that integrate its electronic design automation ...
China Shiming Technology's 5,000-ton LCD Photoresist Dispersion Project Advances in Two Phases
On June 17, Suzhou Shiming Technology disclosed an announcement regarding abnormal fluctuations in s...
China's ByteDance in Talks to Purchase at Least 50,000 AI Inference Chips from Tianshu Zhixin
Chinese internet company ByteDance is in discussions with Shanghai-based artificial intelligence chi...
South Korea's SK Hynix Supplies 12-Layer AI Memory HBM4E Samples to Customers
On June 18, South Korea's SK Hynix announced that it has supplied 12-layer stacked HBM4E samples to ...
China's DSBJ Plans $1.2 Billion Expansion of Optical Chip and Optical Module Capacity in Changzhou
On the evening of June 16, China's Dongshan Precision Manufacturing (DSBJ) issued an announcement on...
Nvidia's $2 Billion Cooperation with Coherent to Quadruple InP Capacity in Sherman, Texas
The expansion of AI computing power is pushing optical communication materials to the forefront of i...
Infineon Launches Automotive-Grade SiC Power Module for Continuous Operation at 205°C
Germany's Infineon Technologies AG has recently launched a new 1300V silicon carbide (SiC) power mod...
China's First 8.6th-Generation AMOLED Production Line Achieves Mass Production and Delivery in Chengdu
On June 17, the mass production and customer delivery ceremony for BOE's 8.6th-generation (Gen 8.6) ...
China's Longsys Launches WM8500 Chip, Enabling 2:1 Compression for 128GB SSDs
China's Longsys has launched a 5nm process chip named WM8500, defined as a Storage Processing Unit (...
China Plans 2 Trillion Yuan Investment in National AI Computing Network, Targeting Completion by 2028
China is drafting a plan to invest approximately 2 trillion yuan (about $295 billion) in building a ...
China's Leju Robot and Huixi Intelligence Reach Strategic Cooperation
China's Leju Robot and Huixi Intelligence have signed a strategic cooperation agreement. The two par...
Chinese and Australian Universities Collaborate to Develop Nanochip Enhancing Imaging Capabilities
A collaborative effort between China's Zhejiang University and Australia's RMIT University has resul...
South Korea's Samsung Electronics plans to expand multi-project wafer service to 2 nanometers by 2027
Samsung Electronics' foundry division will expand its multi-project wafer (MPW) service to the 2-nan...
Japan's Rapidus and UK Semiconductor Centre Sign Semiconductor Manufacturing MoU
Rapidus has signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC) regar...
Google in talks with Samsung for 2nm AI chip components by 2028
Google is reportedly in talks with Samsung Electronics to have the latter help produce some componen...
Japan's JX Metals to Invest 120 Billion Yen to Expand InP Substrate Production for AI Optical Communications
AI data centers are driving a new wave of capacity expansion for high-speed optical communication ma...
Japan's Rapidus and Italy's Chips-IT Sign Semiconductor Manufacturing Cooperation Memorandum
On June 16, Japan's advanced semiconductor company Rapidus announced the signing of a memorandum of ...
China's Hello Inc. Launches World's First Shared Bike with HiSilicon Chip and HarmonyOS
Hello Inc. has launched the world's first shared bike equipped with a HiSilicon chip and HarmonyOS, ...
South Korea's KC Tech Breaks into SK Hynix Supply Chain with Supercritical Cleaning Equipment
Equipment and materials company KC Tech is commercializing a supercritical cleaning system designed ...
TSMC of Taiwan, China, plans to achieve one trillion transistors in a single package by 2030
TSMC, a wafer foundry company in Taiwan, China, plans to integrate one trillion transistors in a sin...
IQE and Tower Semiconductor Sign Indium Phosphide (InP) Epitaxial Wafer Supply Agreement for Silicon Photonics
IQE and Tower Semiconductor have announced a multi-year supply agreement for indium phosphide (InP) ...
German CADFEM and Malaysia's SilTerra Collaborate on Simulation-Driven Semiconductor Innovation
German CADFEM APAC has signed a Memorandum of Understanding with SilTerra Malaysia Sdn. Bhd., a Mala...