en.Wedoany.com Reported - Micron Technology has selected Bechtel as its engineering, procurement, and construction (EPC) partner for Phase 1 of its memory manufacturing complex in Clay, New York. The facility is planned to become the largest semiconductor manufacturing site in the United States.

Since the groundbreaking of New York's first wafer fab in January 2026, Micron has been transitioning to the next construction phase alongside Bechtel. This project is one of the largest private investments in New York State history, expected to generate approximately $16.7 billion in real economic output annually for the state over the next 30 years, and increase personal income for New York residents by approximately $5.4 billion per year.

Micron's memory manufacturing complex is expected to create 50,000 jobs in New York, including over 4,500 construction positions. At peak construction, the project will support thousands of skilled trade professionals, creating opportunities for union trades, apprentices, local training program graduates, specialty contractors, suppliers, and construction professionals. Micron and Bechtel plan to conduct community outreach activities while building the project team and supply chain to help develop the local supply chain and trade workforce ecosystem.

Semiconductor manufacturing facilities require precision construction in cleanroom systems, ultra-high purity process infrastructure, advanced electrical systems, vibration-sensitive foundations, and tightly controlled production environments. Bechtel will deploy an integrated EPC delivery model, combining engineering, procurement, advanced digital construction technologies, modular strategies, and complex project controls to support schedule confidence, workforce coordination, and operational readiness. This project supports broader efforts to expand U.S. semiconductor manufacturing capacity and strengthen the resilience of the American technology supply chain.

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