en.Wedoany.com Reported - The 2026 IPC CEMAC Electronics Manufacturing Annual Conference is scheduled to be held on September 17-18 at the Shanghai Tower. With the theme "Driving a New Era of Electronics," the conference covers topics including advanced packaging and electronic interconnection, electronic assembly and high reliability, digitalization and intelligent manufacturing, as well as green manufacturing and sustainable development.
This annual conference is organized by IPC—Association Connecting Electronics Industries and the Shanghai Pudong New Area Quality and Technical Association, and is open to corporate executives, technical experts, representatives from research institutions, and upstream and downstream enterprises in the electronics manufacturing industry chain. The conference features keynote speeches, technical seminars, standards development technical group meetings, committee meetings, an annual member appreciation and awards dinner, and corporate exhibitions. It focuses on technological evolution, standards application, and industrial collaboration in the new cycle of electronics manufacturing. For electronics manufacturing enterprises, advanced packaging, electronic interconnection, high-reliability assembly, and intelligent manufacturing are becoming key factors affecting product quality, delivery efficiency, and the stability of the supply chain. The value of industry conferences is gradually shifting from mere communication to joint standard development, technology roadmap assessment, and resource alignment across the industry chain.
The conference will be held on the fifth floor of the Shanghai Tower from September 17 to 18. The organizers have opened registration for participation, paper submissions, sponsorship opportunities, and cooperation with media outlets.
The electronics manufacturing industry is simultaneously facing demand changes in areas such as advanced chip packaging, automotive electronics, AI servers, industrial control, communication equipment, and new energy electronics. Advanced packaging and electronic interconnection are critical to the performance release of high-performance chips, modules, and system-level products; electronic assembly and high reliability directly impact the long-term stable operation of scenarios such as aerospace, automotive electronics, medical devices, and industrial equipment; digitalization and intelligent manufacturing are embedding quality traceability, equipment networking, process control, and data analysis into production lines; green manufacturing and sustainable development are making material selection, energy management, waste treatment, and supply chain compliance part of a company's competitiveness. By placing these topics within the same annual conference framework, IPC CEMAC indicates that the electronics manufacturing industry has moved from single-point process optimization to a phase of coordinated upgrading across standards, processes, equipment, materials, and management systems.
During the conference, new standards, industry research reports, and results from intelligent manufacturing demonstration lines will be released, providing enterprises with clearer standard references and engineering practice examples. For participating companies, attention can be directed to the standards development technical group meetings, technical seminars, and corporate exhibitions to assess the pace of implementation of advanced packaging, electronic interconnection, reliable assembly, and intelligent manufacturing within China's electronics manufacturing industry chain. As the complexity of electronic products increases, competition among manufacturing enterprises will increasingly depend on standard understanding, process consistency, quality management capabilities, and cross-link collaboration efficiency.
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