en.Wedoany.com Reported - Cadence Design Systems and Intel Foundry announced an expanded multi-year collaboration, initially focusing on the Intel 14A process node, aimed at accelerating design-technology co-optimization (DTCO) for Intel's next-generation manufacturing processes. The two companies will combine Cadence's AI-driven electronic design automation (EDA) software and design IP portfolio with Intel Foundry's process and packaging technologies to help customers optimize future high-performance computing and mobile chip designs.
The companies stated that the collaboration focuses on optimizing design tools, methodologies, and workflows to improve performance, power, and area (PPA), while delivering a production-ready process design kit (PDK) for Intel 14A. Cadence plans to leverage its agentic AI-driven design flow and core EDA platform to accelerate chip development cycles and reduce design risks for customers targeting Intel Foundry technologies.
This announcement deepens the long-standing relationship between the two companies as Intel works to expand its foundry ecosystem and attract external semiconductor customers. Intel Foundry continues to invest in design enablement, IP availability, packaging technologies, and EDA partnerships to prepare future nodes, including Intel 18A and Intel 14A, for industry adoption. The collaboration focuses on areas including DTCO, PDK development, design flows, and IP readiness, with Cadence deploying agentic AI-driven EDA capabilities to optimize customer designs, primarily for HPC, AI, and mobile semiconductor applications.
Anirudh Devgan, President and CEO of Cadence, stated that advancing their relationship into a deeper collaboration marks an important milestone for both companies. This partnership will leverage the strengths of both sides to empower customers in unlocking new levels of performance, power, and efficiency, accelerating the realization of next-generation products.
The collaboration builds on decades of relationship between Cadence and Intel. Cadence has long supported Intel's process technologies through certified design flows, IP development, packaging design tools, and manufacturing enablement programs. As Intel transitions Intel Foundry into an independent business unit, Cadence has become a key EDA partner alongside Synopsys and Siemens EDA. This partnership has gained increased attention following Lip-Bu Tan's return to Intel as CEO in 2025. Tan served as CEO of Cadence from 2009 to 2021, driving significant growth in system design, verification, and AI-enhanced EDA technologies; he later served as Intel's board chair before stepping down in 2024, and subsequently returned to Intel as CEO. His relationships within the semiconductor design ecosystem, including at Cadence, are seen as a valuable asset as Intel strengthens its key EDA, IP, and foundry ecosystem collaborations.
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