en.Wedoany.com Reported - On June 11, Siling Integrated disclosed a new round of industrial investment plans, proposing to establish a joint venture project with the Shaoxing Area Management Committee of the Hangzhou-Shaoxing Airport Economic Integration Development Demonstration Zone and other partners to build a 12-inch automotive-grade analog-mixed signal chip production line in Shaoxing, Zhejiang. The project has a total planned investment of approximately 20 billion yuan, with a designed monthly production capacity of 50,000 wafers. It is the fourth key project promoted by Siling Integrated in Shaoxing.
The new production line will be implemented by Siling Advanced Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. After the investment is completed, Siling Integrated plans to contribute 3.012 billion yuan, holding a 25.1% stake in Siling Advanced; the project capital is 12 billion yuan, supplemented by 8 billion yuan in bank loans. Siling Advanced was originally a wholly-owned subsidiary of Siling Integrated, but after this investment, it will no longer be consolidated into the company's financial statements.
The focus of this production line is not just on expanding wafer manufacturing scale, but more importantly, on extending Siling Integrated's specialty process capabilities into the new track of analog-mixed signal chips. The new project covers 40/28nm MCUs and DSPs, 90/55nm BCD and DrMOS analog circuits, as well as 55nm silicon photonics and laser driver chip directions. Unlike pure digital logic chips, analog-mixed signal chips connect real-world signals with digital computing systems and are widely used in automotive electronics, power management, industrial control, optical communications, and high-performance computing infrastructure.
Siling Integrated has already established a foundation in the manufacturing of Automotive Industry" target="_blank">new energy vehicles and industrial control chips. Automotive-grade chips emphasize long-term reliability, temperature adaptability, and stable supply capabilities, while industrial control chips need to adapt to complex operating conditions and long-cycle operation. With the implementation of this new 12-inch production line, the company can continue to enhance its large-size wafer platform manufacturing capabilities based on its existing automotive and industrial control customer base.
A more significant change comes from the demand for AI computing infrastructure. AI servers impose higher requirements on power management, high-speed communication, and optical interconnects. Power chips need to improve conversion efficiency in high-power, high-density devices, while optical interconnect chips correspond to scenarios such as data centers, AI cluster communication, and high-speed optical modules. By incorporating silicon photonics, laser drivers, and AI server power management into the new project direction, Siling Integrated indicates that its manufacturing capabilities are extending from automotive and industrial scenarios to the computing infrastructure chain.
Shaoxing will also continue to absorb industrial growth in the integrated circuit manufacturing sector. After the implementation of Siling Integrated's fourth-phase project, the local area is expected to generate more demand for plant engineering, semiconductor equipment, electronic materials, clean systems, packaging and testing, and design services around wafer manufacturing. For Zhejiang, adding a new 12-inch wafer line with a monthly capacity of 50,000 wafers is not just an expansion by a single company but also a reinforcement of the region's semiconductor manufacturing capabilities.
However, wafer manufacturing projects still have a long process from construction to capacity release. A 20-billion-yuan level investment requires stages such as factory construction, equipment installation, process validation, customer certification, and capacity ramp-up. Analog-mixed signal chips cover multiple directions including analog, power, control, driver, and optoelectronic conversion, with complex process platforms, and customer introduction cycles can also affect production line utilization.
Siling Integrated's construction of a 12-inch automotive-grade analog-mixed signal chip production line in Shaoxing, Zhejiang, connects four types of demand: new energy vehicles, industrial control, AI server power management, and optical interconnects. As smart cars, AI servers, and data centers continue to expand, the importance of power management, analog circuits, and silicon photonic chips is increasing. Whether the new project can successfully ramp up will become an important milestone for observing the upgrade of China's local specialty process manufacturing capabilities.
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