en.Wedoany.com Reported - On July 7, China's World Group announced a simplified procedure for issuing shares to specific targets, planning to raise nearly 300 million yuan for the diamond micro-drill industrialization project (Phase I), the diamond functional materials industrialization project (Phase I), and the diamond functional materials R&D center project. The micro-drill project is set to invest 134 million yuan, and upon reaching full production, it will generate an annual capacity of 560,000 diamond micro-drills. The functional materials project plans to invest 133 million yuan, enabling an annual output of 270,000 CVD diamond acoustic diaphragms. The R&D center project invests 38.8832 million yuan, focusing on diamond heat dissipation wafers, diamond composite cold plate materials, and quantum-grade diamond crystals.

This fundraising did not allocate additional funds to traditional tooling businesses but instead concentrated resources on two major areas: the high-end upgrade of superhard tools and the industrialization of CVD diamond functional materials, indicating the company's transition from traditional machining tools to high-value-added new material products. In terms of fund allocation, the industrialization projects total approximately 267 million yuan, accounting for nearly 90% of the total fundraising scale, while the R&D center accounts for only a small portion, highlighting the company's strategic focus on prioritizing capacity deployment and achieving large-scale supply.

PCD micro-drills belong to a niche market with high technical barriers. The key to competition in this industry lies not in production scale but in product consistency, machining precision, and the certification cycle of downstream customers. According to the plan, the micro-drill project will add an annual capacity of 560,000 units over a three-year construction period, with new capacity being released steadily to avoid disrupting market supply and demand through concentrated production.

Globally, the industrialization process of large-size, high-quality single-crystal diamonds continues to accelerate. Overseas companies such as Japan's Orbray and the UK's Element Six have already established mass-producible 3-inch single-crystal diamond wafer production lines and are advancing the development of 4-inch wafers, with 2-inch products entering the mass production preparation stage, marking the entry of large-size diamond wafers into industrial manufacturing. Meanwhile, U.S. companies are promoting the application verification of diamond heat dissipation materials in AI servers and high-performance computing, accelerating the commercialization of functional diamonds.

The R&D center project outlines the company's long-term technology roadmap, with a key focus on diamond heat dissipation wafers, composite cold plate materials, and quantum-grade diamond crystals. Among these, diamond heat dissipation wafers are closely tied to AI computing power demands—as the power density of GPUs, ASIC chips, and high-power RF devices continues to rise, traditional copper, aluminum, and ceramic heat dissipation materials are approaching their thermal conductivity limits, making diamond a critical breakthrough direction for the global computing power industry. Currently, this field remains constrained by challenges such as large-size wafer preparation, defect density control, heterogeneous material bonding, and high costs, with short-term applications limited to small-batch production in high-end niche scenarios, but offering significant growth potential in the medium to long term.