French AlpSemi Secures €17 Million in Funding
French startup AlpSemi has completed a €17 million (approximately $19.5 million) funding round to de...
China's Huawei Announces 1.4nm Equivalent Chip Production by 2031
Huawei founder Ren Zhengfei announced that the company is targeting the production of chips with per...
South Korea's SK Hynix Boosts DDR5 Production, Chasing Over 90% Theoretical Gross Margin
On June 23, memory chip giant SK Hynix plans to allocate more new production capacity to DDR5 and LP...
Shanghai Awinic Technology's Lingang Automotive-Grade Chip Testing Center Officially Commences Operations
On June 23, Shanghai Awinic Technology's Lingang "Ink Bottle" automotive-grade experimental testing ...
Samsung Electronics Launches UFS 5.0 Mobile Storage Products
On June 23, Samsung Electronics announced the development of Universal Flash Storage (UFS) 5.0 produ...
India's Semiconductor Accelerates Construction, Tata's INR 270 Billion Plant Nears Production
India's semiconductor industry is transitioning from policy announcements to substantive constructio...
China Xianwei Semiconductor Hefei Base Commences Production, Filling Local Supply Gap for High-Purity Electronic Specialty Gases
On June 22, the production base of Hefei Xianwei Semiconductor Materials Co., Ltd. officially commen...
South Korea's LG Chem Plans 15 Trillion Won Investment in Semiconductor and Robot Materials
South Korea's LG Chem plans to invest 15 trillion won in R&D by 2035, focusing on nurturing future g...
Samsung Electronics' HBM4 Memory Sales First to Surpass $1 Billion in 2026
Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has surpassed $1 billion in sales...
Samsung Electronics Develops Industry's Fastest UFS 5.0, Mass Production in Q4
Samsung Electronics has developed the industry's fastest Universal Flash Storage (UFS) 5.0 solution,...
Micron and Anthropic Sign AI Infrastructure Agreement
Micron Technology announced on June 22 that it has entered into a strategic agreement with AI compan...
Micron's Revenue Forecast at $34.8 Billion
U.S. memory semiconductor company Micron will release its fiscal third-quarter earnings on June 24, ...
Samsung Electro-Mechanics mass-produces FC-BGA for Qualcomm's AI200, expanding collaboration to data centers
Samsung Electro-Mechanics has begun mass production of packaging substrates for Qualcomm's first dat...
UK's Nanopower and Anglia Sign Pan-European Distribution Agreement for nPZero Gen1
Nanopower Semiconductor has selected Anglia Components as its pan-European distribution partner for ...
GlobalFoundries Receives $375 Million from U.S. Government to Establish Quantum Division
GlobalFoundries has established a Quantum Technology Solutions business unit and ceded 1% of its sha...
Micron Selects Bechtel to Build $100 Billion Memory Manufacturing Complex in New York, USA
Micron Technology has selected Bechtel as its engineering, procurement, and construction (EPC) partn...
Japan's Rapidus Receives Additional 150 Billion Yen Funding from IPA
Japan's semiconductor company Rapidus Corporation announced that it has received an additional 150 b...
Infineon and AWS to Launch Cloud MCU Evaluation Platform, Coming in Q3 2026
Infineon Technologies AG is collaborating with Amazon Web Services to launch a cloud platform based ...
Intel Launches CPUs Up to $300 for Budget Gamers
Intel is adjusting its strategy for the PC market, aiming to win back budget-conscious gamers and ha...
Netherlands' Nearfield Instruments Completes $380 Million Series D Funding Round
Nearfield Instruments, a company specializing in advanced semiconductor 3D metrology and process con...
SK hynix surpasses Samsung Electronics to become South Korea's top company by market cap
SK hynix has surpassed Samsung Electronics in market capitalization for the first time, becoming the...
Synopsys Launches First Multiphysics Fusion Solutions
Synopsys, Inc. announced the launch of its first deployable Multiphysics Fusion solutions. As chip d...
Micron and Anthropic Forge Strategic AI Storage Partnership
On June 22, U.S. memory chip company Micron Technology announced a strategic cooperation agreement w...
NVIDIA's Vera Rubin NVL4 System Expected to Ship Starting Q4 2026
On June 22, NVIDIA announced the launch of the Vera Rubin supercomputing platform for scientific com...
Qatar's QIA Participates in US-Based HyperLight's $80 Million Series C Funding Round
On June 18, the Qatar Investment Authority announced its participation in the $80 million Series C f...
Qualcomm reportedly close to $4 billion acquisition of AI chip startup Modular
U.S. chip company Qualcomm is reportedly in advanced talks to acquire AI chip startup Modular, with ...
Intel Advances EMIB-T Packaging, Targeting Nearly 10,000 Square Millimeters by 2028
US-based Intel has established advanced packaging as a core pillar of its foundry strategy, with its...
Japan's chip-making equipment sales to China see first decline of about 10%
Five major Japanese chip-making equipment manufacturers saw their combined sales to China decline by...
Chinese enterprises accelerate layout in trillion-level TGV glass substrate track
Chinese enterprises are accelerating the pilot verification and mass production layout of TGV (Throu...
Intel to Launch Raptor Lake Next Next Year, Mobile Lineup Limited to HX Models
Intel plans to launch its next-generation Raptor Lake Next series of processors, which will cover bo...