Teledyne HiRel Launches Space-Grade Ultra-Low Power Broadband LNA
Teledyne HiRel Semiconductors has announced the launch of the TDLNA0840SEP, a space-qualified ultra-...
Over 80% of Booths Reserved at IICIE Shenzhen, Covering the Full Semiconductor Industry Chain
The IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo) will be held from Se...
Nvidia CEO Jensen Huang begins four-day AI industry visit to South Korea
On June 5, Jensen Huang, founder and CEO of U.S.-based Nvidia, arrived in South Korea, beginning a f...
South Korean AI chip company DeepX to adopt Samsung LPDDR5X-PIM processing-in-memory solution
On June 4, South Korean AI chip company DeepX disclosed that its next-generation edge AI chip, the D...
Air Liquide Invests in Quantum Startup Quobly's €115 Million Funding Round
Air Liquide S.A. (Paris) has made a strategic investment in French startup Quobly through its corpor...
Taiwan's TSMC expects revenue growth of over 30% in 2026
TSMC (Taiwan Semiconductor Manufacturing Co.) is facing capacity constraints, with surging demand fo...
SEMI: Global Semiconductor Equipment Shipments Up 14% YoY in Q1 2026
The International Semiconductor Equipment and Materials Initiative (SEMI) announced in its latest Wo...
China's Eternal Asia Acquires Intel 2026 Solution Aggregator Qualification to Expand Chip and Custom System Distribution
On June 4, Shenzhen Eternal Asia Supply Chain Co., Ltd. and Intel upgraded their strategic partnersh...
China's Beijing Parallel Technology Plans to Purchase 81.63 Million Yuan in Computing Servers and Memory to Expand Its Own Computing Resource Pool
On June 4, Beijing Parallel Technology Co., Ltd. announced that the company plans to purchase GPU co...
China's Eelink Launches 2.4mm BLE 6.0 Temperature Data Logger for Cold Chain Logistics Monitoring
On June 2, China's Shenzhen Eelink Communication Technology released the BTT02 ultra-thin BLE 6.0 te...
EU Launches European Chips Act 2.0 to Strengthen Semiconductor Manufacturing and R&D Commercialization
On June 3, the European Commission proposed the "European Technology Sovereignty Package," which inc...
China's MIIT Launches 6G Ministry-Province Collaborative Pilot to Foster Terminal Chip and Commercial Aerospace Linkage
Recently, the General Office of the Ministry of Industry and Information Technology (MIIT) issued a ...
Foxconn of Taiwan, China, partners with Intel to advance AI infrastructure collaboration from chips to cabinets
On June 4, Foxconn announced a strategic collaboration with Intel to jointly explore next-generation...
Japan's Kioxia to Showcase 245.76TB SSD and AiSAQ at Interop Tokyo 2026
On June 4, Japanese storage company Kioxia announced that it will participate in Interop Tokyo 2026 ...
Navitas Semiconductor Partners with NVIDIA to Advance 800V DC AI Data Center Power Architecture
On June 3, Navitas Semiconductor announced its participation in the NVIDIA MGX ecosystem collaborati...
Broadcom Reports Q2 FY2026 Revenue of $22.2 Billion, Up 48% YoY
Broadcom reported a record Q2 FY2026 revenue of $22.2 billion, up 48% year-over-year, driven by acce...
China's NOVOSENSE Microelectronics to Showcase Automotive and AI Power IC Solutions at PCIM 2026
NOVOSENSE Microelectronics will showcase its latest integrated circuit products in sensing, signal c...
Realtek's 20TOPS AI Accelerator Chip and PCIe Bridge Chip from Taiwan, China Win COMPUTEX Awards
Recently, two chip products from Realtek Semiconductor in Taiwan, China won awards at the COMPUTEX 2...
SoftBank founder Masayoshi Son reclaims Asia's richest title with $100.7 billion net worth
On June 2, Forbes' real-time billionaires list showed that SoftBank Group founder and CEO Masayoshi ...
TSMC's Investment in the US Rises to $165 Billion
TSMC's total investment in its Arizona fab project has surged to $165 billion, a significant increas...
ASPEED Technology Inc. from Taiwan showcases Cupola360 at COMPUTEX 2026, launching the AST1840 integrated platform
ASPEED Technology Inc., a global Baseboard Management Controller (BMC) provider, together with its s...
China's Zeta Technology Unveils Innovation R&D Headquarters in Nanjing in April 2026
The integrated circuit industry in the Yangtze River Delta region accounts for approximately 60% of ...
Illinois Quantum & Microelectronics Park Appoints Deputy Chief Technology Officer
The Illinois Quantum & Microelectronics Park (IQMP) has appointed Dr. Philip Makotyn as Deputy Chief...
Belgian startup eyeo launches waveguide-based color splitting technology, boosting light capture by over 3 times
eyeo, a startup incubated by imec (the Belgian microelectronics research center), is poised to redef...
French SiPearl Tapes Out Rhea1, Completes €130 Million Series A Funding
European chip design company SiPearl has taped out its first processor, Rhea1, and completed a €130 ...
onsemi and WPG Quanteng Collaborate to Launch 75-160W Integrated Power Solutions
WPG Holdings' Quanteng Group, in collaboration with onsemi, hosted an online seminar focusing on 75W...
Global smartphone shipments fell 3.1% in Q1, full-year forecast down 13.9%
The mobile phone industry is experiencing its most severe market contraction in recent years, with s...
Chinese Companies Achieve Independent Mass Production of ACF Conductive Adhesive Film, Priced at Only 60% of Japanese Counterparts
Chinese companies have achieved fully independent and controllable mass production across the entire...
GIGABYTE Showcases CQDIMM Memory at COMPUTEX 2026: 10400 MT/s Speed, 256GB Capacity
GIGABYTE Technology (GIGABYTE) showcased its Z890 Plus series motherboards featuring CQDIMM technolo...
Qorvo Launches Negative Bias-Free SOI RF Switch and Attenuator Portfolio
Qorvo has launched a new portfolio of silicon-on-insulator (SOI) RF switches and digital step attenu...